Portable computing system

ABSTRACT

A portable electronic device having several features is disclosed. The device can include a retention member that retains flexible circuits extending from a top portion to a bottom portion of the device, thereby allowing some components to be moved from a top portion of the device to a bottom portion. The device may include a cover plate can be secured with a display in the top portion to cover the retention member and other internal components. The device can include an omni-directional port designed to receive a connector different orientations and provide power to the device. The device can include a flexible keyboard having butterfly keycaps. The device can include an array of openings for an audio driver, with some of the array including through holes and blind holes. The device can also include a touch pad having a force feedback sensor and a haptic device.

CROSS-REFERENCE TO RELATED APPLICATIONS This Application Claims theBenefit of Priority Under 35 U.S.C. 120 to:

(i) This application is a continuation of U.S. application Ser. No.15/215,532, to Farahani et al., filed Jul. 20, 2016, and title “PORTABLECOMPUTING SYSTEM”, which is a continuation of U.S. application Ser. No.14/642,677, to Farahani et al., filed Mar. 9, 2015, and titled “PORTABLECOMPUTING SYSTEM”, issued Aug. 9, 2016 as U.S. Pat. No. 9,411,380, thecontents of which are incorporated herein by reference in its entiretyfor all purposes.

This Application Claims the Benefit of Priority Under 35 U.S.C. 119(e)to:

(i) U.S. Provisional Application No. 62/101,826, to Shi et al., filedJan. 9, 2015, and titled “TREATMENT OF A SUBSTRATE SUB-SURFACE”;

(ii) U.S. Provisional Application No. 62/101,838, to Robinson et al.,filed Jan. 9, 2015, and titled “ENCLOSURE FEATURES OF A PORTABLECOMPUTING DEVICE”;

(iii) U.S. Provisional Application No. 62/104,597, to Farahani et al.,filed Jan. 16, 2015, and titled “LOGO FEATURES OF A PORTABLE COMPUTER”;

(iv) U.S. Provisional Application No. 62/104,611, to Sweet et al., filedJan. 16, 2015, and titled “HYBRID ACOUSTIC EMI FOAM FOR USE IN APERSONAL COMPUTER”;

(v) U.S. Provisional Application No. 62/106,667, to Sweet et al., filedJan. 22, 2015, and titled “HYBRID ACOUSTIC EMI FOAM FOR USE IN APERSONAL COMPUTER”;

(vi) U.S. Provisional Application No. 62/106,687, to Farahani et al.,filed Jan. 22, 2015, and titled “ENCLOSURE FEATURES OF A PORTABLECOMPUTER”;

(vii) U.S. Provisional Application No. 62/111,036, to Farahani et al.,filed Feb. 2, 2015, and titled “ENCLOSURE FEATURES OF A PORTABLECOMPUTER”;

(vii) U.S. Provisional Application No. 62/106,689, to Reid et al., filedJan. 22, 2015, and titled “KEYBOARD STRUCTURE AND RETENTION FEATURES OFA PORTABLE COMPUTER”;

(ix) U.S. Provisional Application No. 62/111,042, to Reid et al., filedFeb. 2, 2015, and titled “KEYBOARD STRUCTURE AND RETENTION FEATURES OF APORTABLE COMPUTER”;

(x) U.S. Provisional Application No. 62/128,955, to Andre et al., filedMar. 5, 2015, and titled “CHIN PLATE FOR A PORTABLE COMPUTING DEVICE”;

(xi) U.S. Provisional Application No. 62/058,081, to Hendren, filed Sep.30, 2014, and titled “KEYBOARD ASSEMBLY”;

(xii) U.S. Provisional Application No. 62/058,074, to Hendren, filedSep. 30, 2014, and titled “KEYBOARD ASSEMBLY”;

(xiii) U.S. Provisional Application No. 62/058,087, to Hendren, filedSep. 30, 2014, and titled “KEYBOARD ASSEMBLY”;

(xiv) U.S. Provisional Application No. 62/101,854, to Blum et al., filedJan. 9, 2015, and titled “FEATURES OF A FLEXIBLE CONNECTOR IN A PORTABLECOMPUTING DEVICE”;

(xv) U.S. Provisional Application No. 62/129,692, to Farahani et al.,filed Mar. 6, 2015 and titled “PORTABLE COMPUTING SYSTEM”; and

(xvi) U.S. Provisional Application No. 62/129,841, to Hendren et al.,filed Mar. 7, 2015 and titled “KEY FOR KEYBOARD ASSEMBLY”, the contentsof each is hereby incorporated by reference in their entirety.

(xvii) U.S. Provisional Application No. 62/129,842, to Hendren et al.,filed Mar. 7, 2015 and titled “VENTING SYSTEM FOR KEYBOARD ASSEMBLY”;and

(xviii) U.S. Provisional Application No. 62/129,843, to Hendren et al.,filed Mar. 7, 2015 and titled “LIGHT ASSEMBLY FOR KEYBOARD ASSEMBLY”,the contents of each is hereby incorporated by reference in theirentirety.

This Application is Related to the Following Cases:

(i) International Application PCT/US2013/00086, to Parivar et al., withan international filing date of Mar. 15, 2013, and titled “VARYINGOUTPUT FOR A COMPUTING DEVICE BASED ON TRACKING WINDOWS”;

(ii) U.S. Pat. No. 8,633,916, to Bernstein et al., and titled “TOUCH PADWITH FORCE SENSORS AND ACTUATOR FEEDBACK”;

(iii) U.S. Ser. No. 14/499,209, to Leong et al., filed Sep. 28, 2014,and titled “LOW-TRAVEL KEY MECHANISM USING BUTTERFLY HINGES”;

(iv) U.S. Ser. No. 14/058,316, to Leong et al., filed Oct. 21, 2013, andtitled “MULTI-FUNCTIONAL KEYBOARD ASSEMBLIES”;

(v) U.S. Ser. No. 14/543,748 to Amini et al., filed Nov. 17, 2014, andtitled “CONNECTOR RECEPTACLE HAVING A TONGUE”; and

(vi) U.S. Ser. No. 14/641,216, to Farahani et al., filed Mar. 6, 2015and titled “PORTABLE COMPUTING SYSTEM”, the contents of each is herebyincorporated by reference in their entirety.

FIELD

The described embodiments relate generally to portable computingsystems. More particularly, the present embodiments relate to enclosuresof portable computing systems and methods of assembling portablecomputing systems.

BACKGROUND

The outward appearance of a portable computing system, including itsdesign and its heft, is important to a user of the portable computingsystem, as the outward appearance contributes to the overall impressionthat the user has of the portable computing system. At the same time,the assembly of the portable computing system is also important to theuser, as a durable assembly will help extend the overall life of theportable computing system and will increase its value to the user.

One design challenge associated with the manufacture of portablecomputing systems is the design of the outer enclosures used to housethe various internal computing components. This design challengegenerally arises from a number conflicting design goals that include thedesirability of making the outer enclosure or housing lighter andthinner, of making the enclosure stronger, and of making the enclosureaesthetically pleasing, among other possible goals. Lighter housings orenclosures tend to be more flexible and therefore have a greaterpropensity to buckle and bow, while stronger and more rigid enclosurestend to be thicker and carry more weight. Unfortunately, increasedweight may lead to user dissatisfaction with respect to reducedportability, while bowing may damage internal parts or lead to otherfailures. Further, few consumers desire to own or use a device that isperceived to be ugly or unsightly. Due to such considerations, portablecomputing system enclosure materials are typically selected to providesufficient structural rigidity while also meeting weight constraints,with any aesthetic appeal being worked into materials that meet theseinitial criteria.

As such, outer enclosures or housings for portable computing systems areoften made from aluminum, steel and other inexpensive yet sturdy metalshaving a suitable thickness to achieve both goals of low weight and highstructural rigidity. The use of metal enclosures is also convenient fromthe standpoint of providing a ready electrical ground and/or a readyradio frequency (“RF”) or electromagnetic interference (“EMI”) shieldfor the processor and other electrical components of the computingdevice, since a metal enclosure or outer housing can readily be used forsuch functions.

Therefore, it would be beneficial to provide portable computing systemthat is aesthetically pleasing and lightweight, and durable. It wouldalso be beneficial to provide methods for assembling the portablecomputing system.

SUMMARY

This paper describes various embodiments that relate to a portablecomputing system.

A portable computing system includes at least the following: a lidportion that includes a display assembly; a top case pivotally coupledwith the lid portion and including sidewalls that enclose and define acavity and edges of the sidewalls that define a keyboard opening leadinginto the cavity, and a data port including: a receptacle region definedentirely by one of the sidewalls and having a size and shape configuredto receive an electrical connector arranged to pass power and data toand from the portable computing system, a through hole defined by thesidewall and connecting the cavity to the receptacle region, and aprinted circuit board (PCB) disposed within the cavity and including anedge connector protruding from one side of the PCB, the edge connectorextending into the receptacle region by way of the through hole. Theportable computing system also includes a keyboard assembly disposed atleast partially within the cavity, the keyboard assembly having alateral dimension greater than a lateral dimension of the keyboardopening; and a touch-sensitive user interface assembly that includesboth an actuator that provides vibratory feedback at the touch-sensitiveuser interface assembly, and a force sensor arranged to detect an amountof force applied to the touch-sensitive user interface assembly.

In one aspect of the described embodiments, a portable computing systemcan include at least the following elements: a lid portion including adisplay assembly; and a base portion pivotally coupled with the lidportion. The base portion includes a top case defining a speaker grillthat defines a number of speaker holes. The speaker holes can include acombination of blind holes extending partially through a wall of the topcase and through holes extending entirely through the wall of the topcase. The through holes can be positioned proximate speakers disposedwithin an interior volume defined by the base portion. The base portionalso includes a bottom case coupled with the top case to define theinterior volume, the bottom case including an interior facing surfacethat includes a first terraced region having a first thickness and asecond terraced region having a second thickness, the second thicknessbeing greater than the first thickness, an exterior facing cosmeticsurface defining a number of recesses, and a device foot disposed withineach of the recesses defined by the exterior facing cosmetic surface.

In another aspect of the described embodiments, a portable computingsystem includes at least the following elements: a base portion, thatincludes a keyboard assembly disposed within the base portion andincluding a number of keycaps extending through corresponding openingsdefined by a top wall of the base portion, each of the keycaps beingsupported by a low travel support structure and associated with adiscrete LED. The base portion also includes a sidewall defining anopening through which a connector of a printed circuit board extends,the connector being configured to receive electrical power and transmitand receive high-speed data transmissions when a plug is engaged withinthe opening and electrically coupled with the connector; and a lidportion pivotally coupled with the base portion. The lid portionincludes a display, and a retention member that secures one end of aflexible circuit extending between the lid portion and the base portion.

Other aspects and advantages of the invention will become apparent fromthe following detailed description taken in conjunction with theaccompanying drawings which illustrate, by way of example, theprinciples of the described embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIGS. 1-2 illustrate front facing perspective views of a portablecomputing system in an open (lid) state;

FIGS. 3-4 illustrate a portable computing system in a closed (lid)state;

FIG. 5 illustrates a cross sectional view of the rear cover shown inFIG. 3, with a cosmetic logo secured with the logo support;

FIG. 6 illustrates an isometric front view of the cover plate, inaccordance with the described embodiments;

FIG. 7 illustrates an isometric view of an embodiment of a top portionof the portable computing system, in accordance with the describedembodiments;

FIG. 8 illustrates an isometric view of the retention member securedwith the top portion;

FIG. 9 illustrates a cross sectional view of the central region of theretention member, taken along Section B in FIG. 8;

FIG. 10 illustrates a cross sectional view of the first end region ofthe retention member, taken along Section C in FIG. 8;

FIG. 11 illustrates an isomeric view of an interior facing surface of abottom case of a portable computing system, in accordance with thedescribed embodiments;

FIG. 12 illustrates a cross-sectional view of the bottom case shown inFIG. 11, taken along section line D-D;

FIG. 13 illustrates a cross-sectional view of the bottom case shown inFIG. 11, taken along section line E-E;

FIG. 14 illustrates a top view of an interior facing surface of thebottom case having several adhesive structures secured with the terracedregions of the bottom case;

FIG. 15 shows a perspective view of a number of electrical componentssecured to bottom case;

FIG. 16 illustrates a bottom view showing an exterior facing cosmeticsurface of a bottom case having several recesses configured to receivesupport feet;

FIG. 17 illustrates an isometric view of a corner region of a bottomcase prior to receiving a first one of support feet;

FIG. 18 shows an interior facing surface of a top case, in accordancewith the described embodiments;

FIG. 19 shows a top view of an exterior cosmetic surface of a top caseand how an array of speaker holes can extend across a substantialportion of the top case, in accordance with the described embodiments;

FIG. 20 shows a cross-sectional view of the area depicted in the closeup view in FIG. 19 and how the blind holes can be made to look more likethe through holes;

FIG. 21 illustrates a bottom view of the material handling featurecarrying the keyboard assembly over the top case, in accordance with thedescribed embodiments;

FIG. 22 illustrates a side view of the material handling feature, thekeyboard assembly, and the top case shown in FIG. 21;

FIG. 23 illustrates a side view of the material handling featurepartially inserting the keyboard assembly into the top case, inaccordance with the described embodiments;

FIG. 24 illustrates a side view of the material handling feature fullyinserting the keyboard assembly into the top case, in accordance withthe described embodiments;

FIG. 25 illustrates an isometric view of a key mechanism in accordancewith the described embodiment;

FIG. 26 illustrates shows an illustrative cross-sectional view of thekey mechanism of FIG. 25, in accordance with the described embodiments;

FIG. 27 illustrates illustrative perspective view of a butterfly hingeand support structure in accordance with the described embodiments;

FIG. 28 illustrates a side view of a key assembly of a low-travelkeyboard assembly, according to various embodiments;

FIG. 29 illustrates cross-section front view of a low-travel keyboardassembly including a switch housing taken along line CS-CS in FIG. 28,according to embodiments;

FIG. 30 illustrates an exploded view of several layers defining akeyboard shield used with the keyboard assembly, in accordance with thedescribed embodiments;

FIG. 31 illustrates an isometric view of an interior portion of anelectronic device with a touch pad showing the touch pad having forcesensors and an actuator for providing feedback, in accordance with thedescribed embodiments;

FIG. 32 illustrates an enlarged top plan view of a touch pad includinghaptic device, in accordance with the described embodiments;

FIG. 33 illustrates a cross-sectional view of the haptic device of FIG.32, taken along line 33-33 in FIG. 32;

FIG. 34 illustrates a plan view of an interior portion of the bottomcase, in accordance with the described embodiments;

FIG. 35 illustrates an isometric view of an embodiment of a protrusionengaged with a securing member, the protrusion and the securing memberdesigned to secure the top case to the bottom case;

FIG. 36 illustrates a plan view of an interior portion of the bottomcase having securing members disposed on an outer peripheral portion ofthe bottom case, in accordance with the described embodiments;

FIG. 37 illustrates a plan view of an alternate embodiment of theretention feature having a grooved region defined by an additionalmaterial removal region, in accordance with the described embodiments;

FIG. 38 illustrates an isometric view of an embodiment of a retentionfeature including a tab member integrally formed with the retentionfeature;

FIG. 39 shows a cross-sectional view of one end of a top case and abottom case that includes metallic structures that shield a magneticfield sensor from magnetic fields originating from below the bottomcase;

FIG. 40A shows a close up view of a left side of a portable computingsystem and a data port, in accordance with the described embodiments;

FIG. 40B shows a perspective view of an exemplary plug suitable for usewith the data port depicted in FIG. 40A;

FIGS. 40C-40D show cross-sectional views of the data port shown in FIG.40A;

FIGS. 41A-41B show partial cross-sectional views of alternative dataport embodiments;

FIGS. 42 and 43 show various perspective views of a flexible connectorsuitable for routing power and data from the data port shown in FIG.40A;

FIG. 44 shows how a flexible connector can be utilized to electricallycouple two electrical components within a portable computing system,such as a main logic board and I/O board; and

FIG. 45 illustrates a flowchart showing a method for forming a portablecomputing system, in accordance with the described embodiments.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Representative applications of methods and apparatus according to thepresent application are described in this section. These examples arebeing provided solely to add context and aid in the understanding of thedescribed embodiments. It will thus be apparent to one skilled in theart that the described embodiments may be practiced without some or allof these specific details. In other instances, well known process stepshave not been described in detail in order to avoid unnecessarilyobscuring the described embodiments. Other applications are possible,such that the following examples should not be taken as limiting.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting, such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following relates to a portable computing system such as a laptopcomputer, net book computer, tablet computer, etc. The portablecomputing system can include a multi-part housing having a top case anda bottom case joining at a reveal region to form a base portion. Theportable computing system can have an upper portion (or lid) that canhouse a display screen and other related components whereas the baseportion can house various processors, drives, ports, battery, keyboard,touch pad and the like. The base portion can be formed of numeroushousing components that can include top and bottom outer housingcomponents each of which can be formed in a particular manner at aninterface region such that the gap and offset between these outerhousing components are not only reduced, but are also more consistentfrom device to device during the mass production of devices. Thesegeneral subjects are set forth in greater detail below.

In a particular embodiment, the lid portion and base portion can bepivotally connected with each other by way of a pair of hinges. In someembodiments, communication can be routed between the lid and baseportions by flexible cables extending between the base portion and thelid portion. In one particular embodiment, circuitry configured to driveoperations of the display within the lid can be positioned within thebase portion and proximate to a location where the lid and base portionsare pivotally coupled.

The multipart housing can be formed of a strong and durable yetlightweight material. Such materials can include composite materials andor metals such as aluminum. Aluminum has a number of characteristicsthat make it a good choice for the multipart housing. For example,aluminum is a good electrical conductor that can provide good electricalground and it can be easily machined and has well known metallurgicalcharacteristics. Furthermore, aluminum is not highly reactive andnon-magnetic which can be an essential requirement if the portablecomputing system has radio frequency (RF) capabilities, such as WiFi(including dual stream 802.11 ac WiFi), AM/FM, etc. In some embodiments,the multipart housing can be formed by a subtractive machining operationin which portions of a single block of metal are machined away to createone or more housing components with integrally formed features to formthe multipart housing. In order to both protect the multipart housingand provide an aesthetically appealing finish (both visual and tactile),a protective layer can be placed or formed on an external surface of themultipart housing. The protective layer can be applied in such a way toboth enhance the aesthetic appeal of the housing and to protect theappearance of the portable computing system. In one embodiment, when themultipart housing is formed of aluminum, an exterior surface of thealuminum can be anodized to form the protective layer.

The top case can include a cavity, or lumen, into which a number ofoperational components can be inserted during an assembly operation. Inthe described embodiment, the operational components can be insertedinto the lumen and attached to the top case in a “top-bottom” assemblyoperation in which top most components are inserted first followed bycomponents in a top down arrangement. For example, the top case can beprovided and shaped to accommodate a keyboard module. The keyboardmodule can include a keyboard assembly formed of a number of keycapassemblies and associated circuitry, such as a flexible membrane onwhich can be incorporated a switching matrix. In one embodiment, thekeyboard module can be slightly larger than an opening leading into thelumen. In one particular embodiment, the keyboard module can be angledinto the lumen and/or bent to accommodate the opening leading into thelumen.

The keyboard module of the portable computing system can include anynumber of advancements to form an advanced low-profile keyboard module.One advancement that can be utilized to reduce a travel distance of eachkey is a butterfly hinge. The butterfly hinge can be arranged to providepositive actuation of each key over a short travel distance for eachkey. In some embodiments, one or more of the keys of the keyboard modulecan include discrete circuitry that support various functionalityassociated with one or more of the keys of the keyboard module. In someembodiments, the individual circuitry can include discrete lightingelements so that individual keycaps can be selectively illuminated. Insome embodiments, the circuitry under each keycap can serve otherpurposes such as for example force sensing for distinguishing an amountof force exerted upon a particular key. In some embodiments, circuitryin the keycaps can serve to support other functionality that might nototherwise fit within the space provided by the lumen defined by themultipart housing.

In addition to the keyboard, the portable computing system can include atouch sensitive device along the lines of a touch pad, touch screen,etc. In those embodiments where the portable computing system includes atouch pad, the touch pad can be formed from a glass material. The glassmaterial provides a cosmetic surface and is the primary source ofstructural rigidity for the touch pad. The use of the glass material inthis way significantly reduces the overall thickness of the touch padcompared to previous designs. The touch pad can include circuitry forprocessing signals from sensors associated with the touch pad. The touchpad can include any one or more of a number of sensors including touchand force sensitive sensors. In some embodiments, the sensors can beconfigured to react in different ways depending how or in what mannerthe portable computing system is being used. For example, the touch andor force sensing can be more or less sensitive depending upon the amountof sensitivity appropriate for a given application or control.

In the embodiments where at least one of the top case and bottom caseare formed of conductive material, such as aluminum, a good electricalground plane or electrical ground can be provided. The ability toprovide a good ground plane can be particularly advantageous due to theclose proximity of the operational components to one another in theportable computing system. Due to this close proximity, it is desirableto isolate sources of significant RF radiation (such as a main logicboard, or MLB) from those circuits, such as wireless circuits, that aresensitive to RF interference. In this way, at least the conductive topand/or bottom case be used to provide a good chassis ground that, inturn, can be used to electromagnetically isolate the circuits thatproduce RF energy from those components that are sensitive to RF energy.Moreover, by forming both top and bottom case with conductive material,the top and bottom case can be joined to form a base portion that canact as a Faraday cage that can effectively shield the externalenvironment from EMI generated by the portable computing system. TheFaraday cage like attributes of the base portion can also protect RFsensitive components from externally generated EMI.

In order to provide a pleasing aesthetic to the user, the shape of theportable computing system can have a profile that is pleasing to the eyeand to the touch. In the described embodiments, the multipart housingcan have a tapered or asymmetrically shaped geometry. The tapered shapecan be one in which one end is thicker than the other end such that whenthe bottom surface of the portable computing system is placed upon aflat supporting surface, such as a table or desk, the angle presented bythe tapered shaped housing (in particular the tapered shaped upperportion of the multipart housing) can present an easy to use keyboardarrangement and touch pad. In contrast to conventional portablecomputing systems such as laptop computers having a uniformly shapedhousing with little or no angularity, the tapered shape of the portablecomputing system can improve user interaction with the touch pad andkeyboard by presenting the touch pad surface and the keycaps in a morenatural alignment with a user's fingers. In this way, improvedergonomics can help reduce an amount of stress and strain placed uponthe user's wrists. The tapered design can also help to reduce an amountof material utilized in areas of the portable computing system whereextra space or room is not required. It should be noted that in someembodiments, the tapered or asymmetric shaped geometry of the multiparthousing may not result in the user interface being angled towards theuser and may only serve to reduce weight and an overall volume of thehousing.

Due at least in part to the strong and resilient nature of the materialused to form the multipart housing, the multipart housing can include anumber of openings having wide spans that do not require additionalsupport structures. Such openings can take the form of ports that can beused to provide access to internal circuits. The ports can include, forexample, data ports suitable for accommodating cables (USB, Ethernet,FireWire, etc.) connecting external circuits. The openings can alsoprovide access to an audio circuit, video display circuit, power input,etc.

In some embodiments, the amount and number of ports arranged though themulti-part housing may be substantially reduced. For example, numeroustypes of input/output ports and power connectors can be combined into asingle connector, which can take sole responsibility for receiving powerand high-speed data.

These and other embodiments are discussed below with reference to FIGS.1-45; however, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes only and should not be construed as limiting.

FIGS. 1-4 show various views of portable computing system 100 inaccordance with the described embodiments. FIGS. 1-2 show front facingperspective views of portable computing system 100 in an open (lid)state whereas FIGS. 3-4 shows portable computing system 100 in a closed(lid) state. Portable computing system 100 can include base portion 102formed of top case 104 fastened to bottom case 106. Base portion 102 canbe pivotally connected to lid portion 108 by way of hinges that arehidden from view by a cosmetic wall. Base portion 102 can have anoverall tapered shape having a first end sized to accommodate the hingedconnection that pivotally couples base portion 102 to lid portion 108.In the described embodiment, the overall tapered shape of base portion102 can be created by the tapered shape of top case 104. Alternatively,in some embodiments, bottom case 106 is tapered to provide a similarresult. In some embodiments, bottom case 106 and top case 104 cancooperate to define the tapered shape of base portion 102. Top case 104can be configured to accommodate various user input devices such askeyboard 110 and touch pad 112. Keyboard 110 can include a number ofkeycaps 114. In some embodiments, keycaps 114 are low-profile keycaps.In some embodiments, a travel distance of each of keycaps 114 can beminimized so that a volume within base portion 102 is not taken up toaccommodate the travel of each of keycaps 114.

Each of keycaps 114 can have a symbol imprinted thereon for identifyinga key input associated with the particular keycaps 114. Keyboard 110 canbe arranged to receive a discrete input at each of keycaps 114 using afinger motion referred to as a keystroke. In the described embodiment,the symbols on each of keycaps 114 can be laser etched thereby creatingan extremely clean and durable imprint that will not fade under theconstant application of keystrokes over the life of portable computingsystem 100. Touch pad 112 can be configured to receive a user's fingergesturing. A finger gesture can include touch events from more than onefinger applied in unison. The gesture can also include a single fingertouch event such as a swipe or a tap. In some embodiments, touch pad 112can be configured with force detection sensors configured to determinehow much pressure is received at touch pad 112. In this way,applications running on portable computing system 100 can be configuredto respond in different ways to varying levels of pressure applied whenperforming tapping or gesturing actions. Furthermore, in someembodiments touch pad 112 can be configured to provide haptic feedbackto a user interacting with touch pad 112 in the form of vibration oftouch pad 112.

Lid portion 108 can include display 116 and rear cover 118 (shown moreclearly in FIG. 3) that can add a cosmetic finish to lid portion 108 andalso provide structural support to at least display 116. In thedescribed embodiment, lid portion 108 can include display trim 120 thatsurrounds display 116. In some embodiments, both display 116 and displaytrim 120 can be overlaid by a transparent substrate along the lines ofhigh strength glass or plastic. Lid portion 108 can be moved with theaid of a number of hinges that pivotally couple the lid portion to thebase portion, from the closed position to remain in the open positionand back again. Display 116 can display visual content such as agraphical user interface, still images such as photos as well as videomedia items such as movies. Display 116 can display images using anyappropriate technology such as a liquid crystal display (LCD), OLED,etc. Portable computing system 100 can also include image capture device122 located on display trim 120. Image capture device 122 can beconfigured to capture both still and video images. Display trim 120 canbe supported by structural components (not shown) within lid portion 108but attached to rear cover 118. Display trim 120 can enhance the overallappearance of display 116 by hiding operational and structuralcomponents as well as focusing attention onto the active area of display116. In some embodiments, display trim 120 can be colored to blendseamlessly in with display 116 when display 116 is not illuminated. Inaddition to display trim 120, lid portion 108 can also include a chincover 124 that covers a region of lid portion 108 below display 116.Chin cover 124 can be formed from a thin layer of plastic or glass andcolored to blend pleasingly in with the rest of portable computingsystem 100. In some embodiments, chin cover 124 can be configured tomask the appearance of data cables descending from a bottom edge ofdisplay 116. Chin cover 124 can also include markings to help identify atype or brand associated with portable computing system 100. Top case104 can also define data port 126 and audio port 128, which can both beused to transfer data between an external circuit(s) and portablecomputing system 100. In some embodiments, data port 126 can beconfigured to receive power and transmit data. Lid portion 108 can beformed to have unibody construction that can provide additional strengthand resiliency to lid portion 108 which is particularly important due tothe stresses caused by repeated opening and closing. In addition to theincrease in strength and resiliency, the unibody construction of lidportion 108 can reduce overall part count by eliminating separatesupport features. Top case 104 can also define an array of speaker holes130 through which speakers coupled to bottom case 106 can transmit audiocontent. Top case 104 can also define microphone openings 132 that areconfigured to provide a conduit through which microphones within baseportion 102 can record audio content.

FIGS. 3-4 show top and bottom perspective views of portable computingsystem 100. More specifically, FIG. 3 shows a top view of portablecomputing system 100 showing rear cover 118 of lid portion 108 thatpartially defines an outward cosmetic appearance of portable computingsystem 100. Rear cover 118 also defines an opening within which cosmeticlogo 134 can be retained. In some embodiment, cosmetic logo 134 can takethe form of an at least partially transparent window that can beilluminated by light emitted by display 116. In other embodiments, theopening can take the form of a recess that accommodates cosmetic logo134 when cosmetic logo 134 takes the form of a metallic logo. Themetallic logo can be finished in a way manner that contrasts with thecosmetic surface of rear cover 118. FIG. 4 shows a bottom perspectiveview of portable computing system 100 in which a protruding end 135 oflid portion 108 conceals a back end of portable computing system 100where lid portion 108 is coupled with base portion 102. Also, as shown,lid portion 108 includes protruding end 135 capable of pivoting withrespect to base portion 102. FIG. 4 also shows how support feet 136 canbe arranged along bottom case 106 to provide support to portablecomputing system 100. Support feet 136 can be formed of wear resistantand resilient material such as plastic, silicone or rubber. In someembodiments, support feet 136 can be mounted to bottom case 106 in amanner similar to the way in which cosmetic logo 134 is mounted to rearcover 118. In some embodiments, a portion of support feet can extendthrough an opening defined by bottom case 106 and then be heat staked toan interior facing surface of bottom case 106.

Referring again to FIGS. 1-4, the enclosure of portable computing system100 includes lid portion 108, including rear cover 118 and protrudingend 135, and base portion 102, defined by top case 104 and bottom case106. In some embodiments, top case 104, bottom case 106, lid portion108, rear cover 118, and protruding end 135 are formed from a metal,such as aluminum. Accordingly, in those embodiments, portable computingsystem 100 can include an all-metal enclosure, which refers to aportable computing system having an entire outer peripheral portion,with the exception of support feet 136, that includes metal. This allowsfor a rigid, protective enclosure surrounding the components of portablecomputing system 100 (see FIG. 3, for example).

Generally, radio frequencies sent and received from a radio antenna fromdevices such as WiFi or Bluetooth radios cannot permeate through a metalenclosure. Accordingly, traditional portable computing systems mayinclude a plastic or non-metal structure that allows for transmission ofthe radio frequencies for wireless communication with an external radio.However, portable computing system 100 having an all-metal enclosure maynonetheless include various radios and radio antennas integrated withinthe all-metal enclosure and disposed in regions other than protrudingend 135 to accommodate the all-metal enclosure. For example, in someembodiments, one or more radio antennas are disposed behind chin cover124 (shown in FIG. 1) which is designed to allow radio frequencies topermeate through chin cover 124. Also, one or more radio antennas mayremain disposed proximate to protruding end 135 and rely on openings,such as speaker holes 130 (shown in FIG. 1), for transmission of radiofrequencies.

FIG. 5 illustrates a cross sectional view of rear cover 118 shown inFIG. 4, with cosmetic logo 134 secured with logo support 518. As shown,cosmetic logo 134 is secured with logo support 518 via adhesive layer542. Also, logo support 518 may be part of a substrate, such as rearcover 118. Also, indention region 546 ensures the cosmetic logo 134 isnot disturbed by tapered region 544 of rear cover 118. Further, darkenedregion 548 disguises surface 528 of relief section 524 as well as aportion of indention region 546. In this manner, a user viewing cosmeticlogo 134 may not be able to view surface 528 through gap 536.

Logo support 518 of rear cover 118 is generally flat. That is, logosupport 518 is generally parallel to exterior region 506 of rear cover118. This ensures cosmetic logo 134, when secured with logo support 518,is also flat. In order to ensure logo support 518 is flat, a cuttingtool (not shown) may include certain cutting techniques. The formationof the logo support 518 and cutting techniques used to form the logosupport 518 are described and explained in U.S. Provisional Application62/104,597, to Farahani et al., and titled “LOGO FEATURES OF A PORTABLECOMPUTER”, the contents of which are incorporated herein by reference inits entirety.

FIG. 6 illustrates an isometric front view of chin cover 124, inaccordance with the described embodiments. Chin cover 124 may includeseveral features. For example, chin cover 124 may include substrate 632.In some embodiments, substrate 632 is formed from plastic. In otherembodiments, substrate 632 is formed from carbon fiber. Further, inother embodiments, substrate 632 is formed from fiberglass. In theembodiment shown in FIG. 6, substrate 632 is formed from glass.Accordingly, substrate 632 may be formed from a transparent material.Generally, the substrate 632 can be formed by any material or materialsthat include a relatively high stiffness-to-thickness ratio, while alsoallowing electromagnetic waves (such as RF) to pass through substrate632. In this manner, an internal component such as an antenna (notshown) can be positioned in lid portion 108 (shown in FIG. 1) and alsobehind substrate 632, and the internal component still send and receiveelectromagnetic waves passing through substrate 632. In otherembodiments, substrate 632 is formed from stainless steel sufficientlythin to allow electromagnetic waves to pass.

Also, in order to increase the stiffness of substrate 632, substrate 632may undergo a chemical process designed to chemically strengthensubstrate 632. This may include submerging substrate 632 in a chemicalbath that includes potassium nitrate at a relatively high temperature(for example, 300 degrees Celsius or greater). In addition, substrate632 undergoes additional processes to alter the texture or roughness.For example, substrate 632 may undergo a blasting process (for example,sand blast) and/or chemical etching process to obtain a surfaceroughness similar to that of track pad 124 (shown in FIG. 1). Inaddition, in some embodiments, substrate 632 includes an anti-reflectivecoating. In this manner, chin cover 124 may include an appearancesubstantially similar to that of the display 116 (shown in FIG. 1).

As shown, substrate 632 includes first surface 634. First surface 634,when assembled, is associated with a surface that extends away fromdisplay 116 (shown in FIG. 1) or a cover glass disposed over display116. In other words, first surface 634 is a surface that is visible wheninstalled on display 116 or the cover glass. It will be appreciated thatthe first surface 634 may undergo or include the previous processes(such as the blasting process, chemical etching, and the anti-reflectivecoating). Along with substrate 632, chin cover 124 may include severalfeatures. For example, chin cover 124 may include first layer 642. Insome embodiments, first layer 642 is an ink layer. Generally, firstlayer 642 is an opaque layer applied to substrate 632. Accordingly,first layer 642 may be formed from a relatively dark material, such asblack ink. However, alternatively, an opaque material including alighter color may be applied. Also, in some embodiments, first layer 642is applied by screen printing onto a second surface of substrate 632.The second surface may be referred to as a surface that is oppositefirst surface 634. This will be discussed below. Accordingly, as shownin the enlarged view, first layer 642 may be located behind substrate632 and therefore positioned between substrate 632 and display 116 whenchin cover 124 is installed. However, when substrate 632 is formed froma transparent material such as glass, first layer 642 is still visiblewhen chin cover 124 is installed.

Chin cover 124 can also include second layer 652. In some embodiments,the second layer 652 defines an indicium, which can include letters,words, symbols, shapes, or a combination thereof. As shown in FIG. 6,second layer 652 includes several letters. Like first layer 642, secondlayer 652 may also be applied to the second surface of substrate 632.Further, first layer 642 may be applied to substrate 632 such thatcertain voids in first layer 642 define an outer perimeter of secondlayer 652. In other words, first layer 642 may not be fully applied tothe second surface, and in those regions, second layer 652 is applied tothe second surface of substrate 632. Second layer 652 may include anymaterial or materials used to form first layer 642, and may be appliedto the second surface in any manner used to apply first layer 642.However, second layer 652 may include an appearance different from thatof first layer 642. For example, first layer 642 may be black whilesecond layer 652 is selected from a color consisting of gray, red, blue,green, yellow, or a combination thereof. Also, in some embodiments,second layer 652 has a color or general appearance similar to that oftouch pad 112 (shown in FIG. 1), such as gray.

Chin cover 124 may further include third layer 662 disposed on firstlayer 642 and second layer 652. Third layer 662 may be formed from anymaterial used to form first layer 642 and second layer 652, and may beapplied to the second surface in any manner used to apply first layer642 and second layer 652. In some embodiments, third layer 662 includesa relatively dark appearance similar to that of first layer 642.

Chin cover 124 may include first dimension 672 representative of alengthwise dimension of chin cover 124. First dimension 672 may beapproximately similar to a lengthwise dimension of display 116 or thecover glass. However, in other embodiments, first dimension 672 can beincreased or decreased to a desired dimension. Also, chin cover 124 caninclude extended region 680 having second dimension 682 than firstdimension 672. Generally, second dimension 682 is approximately greaterthan a dimension of a recessed portion of the top case 104 (shown inFIG. 1) that allows for top case 104 to receive a portion of a clutchassembly (not shown). In this manner, extended region 680 of chin cover124 may hide or cover additional internal components when portablecomputing system 100 is in an open configuration (shown in FIGS. 1-2).Further, first layer 642 and third layer 662 may also be applied toextended region 680.

Chin cover 124 may include thickness 688 that accounts for the combinedthickness of substrate 632, first layer 642, second layer 652, and thirdlayer 662. In some embodiments, thickness 688 is less than 1 millimeter(“mm”). In the embodiment shown in FIG. 6, thickness 688 is less than0.4 mm. It will be appreciated that some features or dimensions are notdrawn to scale and may be exaggerated to show certain details. Varioustexturing techniques for substrate 632 are described and explained inU.S. Provisional Application 62/128,955, to Andre et al., and titled“CHIN PLATE FOR A PORTABLE COMPUTING DEVICE”, the contents of which isincorporated herein by reference in its entirety.

FIG. 7 illustrates an isometric view of an embodiment of lid portion 108of a portable computing system, in accordance with the describedembodiments. Lid portion 108 may also be referred to as a displayhousing. Display 116 of lid portion 108 is removed to show certainstructural features of the lid portion 108. Lid portion 108 can includepart of flexible circuit assembly 702 that includes one or more flexiblecircuits electronically coupled to components in another location of theportable computing system (not shown). Flexible circuit assembly 702 mayalso extend into base portion 102 (shown in FIG. 1) and electricallyconnect with one or more components, such as a processor circuit and/ora battery pack. In this manner, the top portion 704 can receiveelectrical power (from the battery pack) and/or data communication (fromthe processor circuit) from base portion 102 via flexible circuitassembly 702. As shown, flexible circuit assembly 702 is coupled withconnector 756 that may be connected to an integrated circuit or anotherflexible circuit (not shown). However, as lid portion 108 may bepivotally coupled with base portion 102, some moving parts can exert aforce on flexible circuit assembly 702. In some cases, after severalcycles of rotating or pivoting lid portion 108 with respect to baseportion 102, the force exerted on flexible circuit assembly 702 cancause flexible circuit assembly 702 to decouple from connector 756. As aresult, flexible circuit assembly 702 no longer relays power and/or datacommunication to lid portion 108.

Lid portion 108 can be modified to receive a feature designed to counterthe forces exerted on flexible circuit assembly 702 previouslydescribed. Before installing the feature, lid portion 108 may undergoseveral material removal processes by a cutting tool (such as aT-cutting tool). For example, the material removal processes can definefirst undercut region 706 and second undercut region 708, both of whichcan be designed to receive a portion of the feature, which will bedescribed below. Also, lid portion 108 can including first mounting hole712 and second mounting hole 714 designed to secure the feature with lidportion.

FIG. 8 illustrates an isometric view of retention member 820 securedwith lid portion 108. As shown, first mounting structure 832 and secondmounting structure 834 receive first fastener 852 and second fastener854, respectively, to secure retention member 820 with lid portion 108.However, prior to using first fastener 852 and second fastener 854,first extension 826 and second extension 828 are first inserted, orhooked, into first undercut region 806 and second undercut region 808,respectively. In this configuration, first extension 826, secondextension 828, central region 840, and a compressible member (not shown)combine to define a counteracting force such that flexible circuitassembly 802 remains relatively immobile in a location proximate toconnector 856.

In some embodiments, retention member 820 is formed from a metal (suchas aluminum). In the embodiment shown in FIG. 8, retention member 820 isformed from a polycarbonate material, which may include glass fiber.Further, in some embodiments, the materials used to form retentionmember 820 are injection-molded into a cavity (not shown) that definesthe size and shape of retention member 820. This allows for retentionmember 820 having both a lightweight and custom design that fits into arelatively small space.

FIG. 9 illustrates a cross sectional view of central region 840 ofretention member 820, taken along Section B in FIG. 8. As shown,compressible member 842 in central region 840 engages flexible circuitassembly 802 such that flexible circuit assembly 802 is engaged with lidportion 108, thereby limiting the overall movement of flexible circuitassembly 802 in a location proximate to connector 856.

FIG. 10 illustrates a cross sectional view of first end region 822 ofretention member 820, taken along Section C in FIG. 8. As shown, firstextension 826 engages first undercut region 806 of lid portion 108 toprovide part of the counteracting force of retention member 820. It willbe appreciated that second extension 828 and second undercut region 808include substantially similar features and configurations.

Retention member 820 is described and explained in: (i) U.S. ProvisionalApplication 62/106,687, to Farahani et al., and titled “ENCLOSUREFEATURES OF A PORTABLE COMPUTER”; (ii) U.S. Provisional Application62/111,036, to Farahani et al., and titled “ENCLOSURE FEATURES OF APORTABLE COMPUTER”; (iii) U.S. Provisional Application 62/106,689, toReid et al., and titled “KEYBOARD STRUCTURE AND RETENTION FEATURES OF APORTABLE COMPUTER”; and (iv) U.S. Provisional Application 62/111,042, toReid et al., and titled “KEYBOARD STRUCTURE AND RETENTION FEATURES OF APORTABLE COMPUTER”, the contents of which is incorporated herein byreference in its entirety.

FIG. 10 illustrates a cross sectional view of first end region 822 ofretention member 820, taken along Section C in FIG. 8. As shown, firstextension 826 engages first undercut region 806 of the lid portion 108to provide part of the counteracting force of retention member 820. Itwill be appreciated that the second extension 828 and the secondundercut region 808 (shown in FIG. 8) include substantially similarfeatures and configurations. The retention member 820 is described andexplained in: (i) U.S. Provisional Application 62/106,687, to Farahaniet al., and titled “ENCLOSURE FEATURES OF A PORTABLE COMPUTER”; (ii)U.S. Provisional Application 62/111,036, to Farahani et al., and titled“ENCLOSURE FEATURES OF A PORTABLE COMPUTER”; (iii) U.S. ProvisionalApplication 62/106,689, to Reid et al., and titled “KEYBOARD STRUCTUREAND RETENTION FEATURES OF A PORTABLE COMPUTER”; and (iv) U.S.Provisional Application 62/111,042, to Reid et al., and titled “KEYBOARDSTRUCTURE AND RETENTION FEATURES OF A PORTABLE COMPUTER”, the contentsof which is incorporated herein by reference in its entirety.

FIG. 11 illustrates an isomeric view of interior facing surface 1102 ofbottom case 106 of portable computing system 100, in accordance with thedescribed embodiments. Bottom case 106 provides a base upon whichportable computing system 100 rests (shown in FIG. 1). As shown, bottomcase 106 has undergone multiple material removal processes to defineseveral terraced regions and structural support features throughoutbottom case 106. For example, bottom case 106 includes first terracedregion 1104 and second terraced region 1106, both of which arepositioned at a substantially similar vertical elevation within bottomcase 106. Also, bottom case 106 may further include third terracedregion 1108 and fourth terraced region 1110, both of which arepositioned at a substantially similar vertical elevation within bottomcase 106. However, third terraced region 1108 and fourth terraced region1110 are positioned at an elevation higher than that of first terracedregion 1104 and second terraced region 1106. Also, bottom case 106 mayfurther include fifth terraced region 1112 and sixth terraced region1114, both of which are positioned at a substantially similar verticalelevation within bottom case 106. Fifth terraced region 1112 and sixthterraced region 1114 are positioned at an elevation higher than that ofthird terraced region 1108 and fourth terraced region 1110. The terracedregions previously described provide additional space for a portablecomputing system in order to compensate for a smaller form factor of theportable computing system. For example, the terraced regions can receiveone or more battery packs having geometry complementary to that providedby bottom case 106. This allows for additional volume for the one ormore battery packs as opposed to a bottom case having a substantiallyplanar interior-facing surface. While bottom case 106, as shown in FIG.11, includes a generally symmetric design, in other embodiments, bottomcase 106 is asymmetric. For example, first terraced region 1104 mayinclude a surface area greater than that of second terraced region 1106.

Bottom case 106 can further include additional regions defined by thematerial removal processes. For example, as shown, bottom case 106includes a number of structural ribs taking the form of ribs 1116, 1118and 1120. Because the nature of the subtractive machining operationallows for the structural ribs to be arranged in any geometry, portionsof the ribs 1116, 1118 and 1120 can include spline shaped or non-conicalcurves. Ribs 1116, 11118 and 1120 can provide support to bottom case 106by, for example, engaging top case 104 (shown in FIG. 1) when top case104 and bottom case 106 are coupled together and also by increasing arigidity of bottom case 106. Furthermore, ribs 1116, 1118 and 1120further define an area in which an internal component (e.g., integratedcircuit) can be received by bottom case 106. In some embodiments,various structural ribs can constrain motion of one or more internalcomponents in contact with bottom case 106. In some embodiments, theformation of bottom case 106 can include an additional material removalprocess that defines cavity 1122 or recess designed to receive anadditional internal component.

In some embodiments, a single material removal process with a particularcutting tool is used is applied to a block of material. In someembodiments, the block of material can take the form of an extrudedaluminum alloy. In the embodiment shown in FIG. 11, a first cuttingprocess is performed to bottom case 106. The first cutting process usesa first cutting tool. Also, the first cutting process can be referred toa rough cut as a substantial portion of the bottom case 106 is removed.The pattern taken by the first cutting process can be performed in araster scan operation, or alternatively, in a spiral pattern. Then, asecond subsequent cutting process can be performed. The second cuttingprocess can include a second cutting tool with a larger radius than thatof the first cutting tool. In this manner, the edges defined by thesecond cutting tool are generally smoother and reduce the probability ofsharp edges that can cut internal components, such as the battery packs.Moreover, a two-part cutting process can reduce manufacturing times ofthe bottom case 106 when compared with a more traditional, singlecutting operation.

Also, the corner regions of bottom case 106 include a pair of openingsdesigned to receive a foot that engages a surface on which bottom case106 can be positioned. For example, first corner region 1140 includesfirst cavity 1142 and second cavity 1144 that include openings thatextend entirely through bottom case 106. These will be described indetail below. Portable computing system 100 having bottom case 106 withterraced regions previously described allows for portable computingdevice 100 having no fan assembly, which is often found in traditionalportable computing systems. Accordingly, portable computing device 100may operate with less noise, as noise due to the fan assembly is nolonger present.

FIGS. 12 and 13 are cross-sectional views of FIG. 11 and illustrate thevarious elevations of bottom case 106 defined by the two-part materialremoval process. FIG. 12 illustrates a cross-sectional view of thebottom case shown in FIG. 11, taken along section line D-D. As shown, inthe z-dimension, first terraced region 1104 is below third terracedregion 1108, which in turn is below fifth terraced region 1112. FIG. 13illustrates a cross-sectional view of the bottom case shown in FIG. 11,taken along section line E-E. Ribs 1118 and 1120 are higher in elevationin a z-dimension than a region between ribs 1118 and 1120. Also, cavity1122 is lower in the z-dimension as compared to cross-sectional regionsof bottom case 106 shown in FIG. 12, specifically fifth terraced region1112.

FIG. 14 illustrates a top view of interior facing surface 1102 of bottomcase 106 having several adhesive structures secured with the terracedregions of bottom case 106. For instance, first terraced region 1104 andsecond terraced region 1106 include first adhesive ring 1402 and secondadhesive ring 1404, respectively. Also, central region 1406 of thebottom case 106 includes third adhesive ring 1408 and fourth adhesivering 1410. The adhesive rings previously described may be used to secureinternal components (for example, battery packs) with bottom case 106.In some embodiments, the adhesive rings are formed from a pressuresensitive adhesive (PSA). Also, the adhesive rings can have a size and ashape that provides sufficient adhesive force to retain the internalcomponents in place. Moreover, the adhesive rings are not excessivelylarge to provide unnecessary adhesion forces. In this manner, a portablecomputing system 100 (shown in FIG. 1) can be made with a reduced weightbased on the size and shape of the adhesive rings. Further, internalcomponents secured with bottom case 106 may include a terraced designcorresponding to the terraced regions of bottom case 106. For example,one or more battery packs may include a shape or contour correspondingto first terraced region 1104, third terraced region 1108, and/or fifthterraced region 1112 (shown in FIG. 11). In this manner, the spaces orvoids defined by the terraced regions of bottom case 106 may be occupiedby the one or more contoured battery packs. Accordingly, portablecomputing system 100 can include greater battery capacity which can leadto longer usage of portable computing system 100 between consecutivecharges of the contoured battery packs. Also, the terraced designed ofthe battery packs can be chosen to include a shape corresponding to theterraced regions of bottom case 106 even in those embodiments in whichbottom case 106 is asymmetric. For example, one or more contouredbattery packs disposed over second terraced region 1106, fourth terracedregion 1110, and/or sixth terraced region 1114 (shown in FIG. 11) mayinclude a size and shape different (smaller or larger) than that of theone or more battery packs covering to first terraced region 1104, thirdterraced region 1108, and/or fifth terraced region 1112.

Bottom case 106 may include other adhesive structures. For example,first adhesive structure 1412 is located between ribs 1116, 1118, and1120 while additional adhesive structures 1414, 1416 and 1418 aredisposed forward of rib 1120. In some embodiments, the first adhesivestructure 1412 secures an internal component, such as an integratedcircuit on a printed circuit board to bottom case 106 while theadditional adhesive structures can be used for mounting speaker modulesand display circuitry to bottom case 106. Also, cavity 1122 may includesecond adhesive structure 1420 designed to secure another internalcomponent with bottom case 106. The adhesive structures can take theform of strips of pressure sensitive adhesive. By securing rigidinternal components to bottom case 106, the overall structural rigidityof bottom case 106 can be increased and therefore compensates bottomcase 106 in instances when bottom case 106 that is relatively thin. Insome embodiments, the adhesive structures can be formed of electricallyconductive pressure sensitive adhesive so that the internal componentscan be grounded to bottom case 106 through the adhesive structure. Itshould be noted that in some embodiments components can alternatively befastened to bottom case 106 by a number of fasteners. It should be notedthat additional details regarding the formation and structure of bottomcase 106 can be found in U.S. Provisional Application No. 62/111,042, toReid et al., filed Feb. 2, 2015, and titled “KEYBOARD STRUCTURE ANDRETENTION FEATURES OF A PORTABLE COMPUTER”.

FIG. 15 shows a perspective view of a number of electrical componentssecured to bottom case 106. The electrical components can includeassemblies 1500 that include speaker and antenna components. Displaycircuitry 1550 can also be attached to bottom case 106. Assemblies 1500are configured to electrically isolate speaker components disposedwithin speaker housing 1502. Speaker housing 1502 can be at leastpartially coated with a layer of conductive material to preventelectromagnetic interference (EMI) from entering or leaving speakerhousing 1502. Each of assemblies 1500 also includes conductive gaskets1504 that provide a conduit for routing audio signals from withinspeaker housing 1502 out of base portion 102. When bottom case 106 isjoined to top case 104 (shown in FIG. 1), conductive gaskets 1504 arecompressed against an interior facing surface of top case 104. Onceconductive gaskets 1504 are compressed they can create a grounding pathbetween each of assemblies 1500 and top case 104. In some embodiments,conductive gaskets 1504 can be made up of a windowed block of closedcell foam surrounded by a layer of conductive fabric. The windowed blockof closed cell foam can include a number of conductive pathways runningthrough the windowed block of closed cell foam. In this way, any EMI notblocked by the conductive fabric can be blocked by a faraday cage formedthrough the conductive pathways defined within the windowed block ofclosed cell foam. The closed cell foam is also operative to preventaudio from escaping through the conductive gaskets 1504. Assemblies 1500can also include antennas 1506 disposed along an exterior surface ofspeaker housing 1502. Antennas 1506 are positioned to transmit andreceive wireless signals through an opening defined by a gap between topcase 104 and bottom case 106 that is at least partially covered by lidportion 108 and a radio frequency transparent cosmetic cover (such aschin cover 124, shown in FIG. 6). Assemblies 1500 can also include flexconnectors extending through speaker housing 1502. In some embodiments,speaker housing 1502 can be formed from two housing components and theflex connector can be configured to extend through an interface betweenthe housing components. In this way audio data can be routed intospeaker housing 1502. As mentioned above, bottom case 106 can alsosupport display circuitry 1550. Display circuitry 1550 can include videoprocessors and circuit boards configured to drive operations of display116. Flexible circuits 1552 can be configured to route the instructionsgenerated by display circuitry 1550 into lid portion 108 as previouslydescribed in FIGS. 7-10. In some embodiments, display circuitry 1550 canbe attached first to top case 104 and simply compressed against aninterior facing surface of bottom case 106. It should be noted thatadditional details regarding the combined speaker and antenna assemblycan be found in U.S. Provisional Application No. 62/104,611, to Sweet etal., filed Jan. 16, 2015, and titled “HYBRID ACOUSTIC EMI FOAM FOR USEIN A PERSONAL COMPUTER”.

FIG. 16 illustrates a bottom view showing an exterior facing cosmeticsurface of bottom case 106 having several recesses 1602 configured toreceive support feet 136. Recesses 1602 can have size and shape thatcorresponds to the size and shape of support feet 136. In this way, whensupport feet are positioned within corresponding recesses 1602, supportfeet 136 can be prevented from shifting in the X and Y axes by wallsdefining recesses 1602. Due to the spacing limitations created by theterraced regions previously described, a particular process is developedto secure support feet 136 to bottom case 106. In some embodiments,recesses 1602 can be quite shallow so that no more than a slight lip isdefined by bottom case 106. The slight lip can be just tall enough toconstrain lateral motion of support feet 136 along the exterior facingcosmetic surface during an installation operation.

FIG. 17 illustrates an isometric view of a corner region of bottom case106 prior to receiving a first one of support feet 136. As shown, firstcavity 1142 and second cavity 1144 of bottom case 106 include openings1702 designed to receive protrusions 1704 of support foot 136. Usingmultiple protrusions makes support foot 136 more robust. For example, ifone or more of protrusions 1704 breaks off of support foot 136 theremaining protrusions 1704 are capable of securing support foot 136 withbottom case 106. It should be noted that while four protrusions 1704 andcorresponding openings 1702 are depicted that other configurations witha greater or lesser number of protrusions and openings are certainlypossible.

Recesses 1602 disposed across the exterior facing surface shown in FIG.16 can be defined at least in part by a laser ablation process depictedby the circular dashed region 1602 in FIG. 17. The laser ablated portionthat defines a periphery of each of recesses 1602 can be used to definea further material removal process in which recesses 1602 are formed.Also, although not shown, an adhesive, such as pressure sensitiveadhesive (PSA), can be positioned within the recesses 1602, and can beused to further secure support feet 136 to bottom case 106.

Once support feet 136 are placed within recesses 1602 and theprotrusions of support feet 136 extend through openings 1702 of bottomcase 106 a heat deforming member can engage the protrusions of foot 136.The heat deforming member can define a heat staking process designed tomelt each of the protrusions 1704. Once the melting process is finished,the heat deforming member can be removed. After protrusions 1704 aredeformed by the melting process, protrusion 1704 define mechanicalinterlocks in first cavity 1142 and second cavity 1144. In this manner,support feet 136 can be secured with bottom case 106 by the resultingmechanical interlocks and an adhesive layer (not shown). Also, firstcavity 1142 and second cavity 1144 are designed such that the mechanicalinterlocks are sub-flush, or below, the surrounding surfaces of thebottom case. In this manner, the mechanical interlocks do not disturbother internal components, such as a battery pack, proximate to firstand second cavities 1142 and 1144.

FIG. 18 shows an interior facing surface of top case 104. Top case 104may further include several side rails used to create space between topcase 104 and bottom case 106 (not shown). For example, top case 104 caninclude side rails 1802. Also, top case 104 may include several cavitiesproximate to or defined by side rails 1802. For example, side rails 1802include end cavities 1804 that can take the form of threaded aperturesfor receiving fasteners in the form of screws. In some embodiments, endcavities 1804, shown as dotted lines are positioned at least partiallywithin an undercut region defined by side rails 1802 (from a bottomview). In the depicted embodiment, some of end cavities 1804 arepositioned completely within the undercut region defined by side rails1802. End cavities 1804 may be designed and positioned to providefurther securing means for various internal components, such as forexample a keyboard assembly. Also, although not shown, the interiorfacing surface of top case 104 can receive an adhesive, along the linesof a layer of pressure sensitive adhesive (“PSA”). Moreover, the PSA canbe applied in various locations along a keyboard rib structure 1816 oftop case 104, with keyboard rib structure 1816 defined as a web regionto receive keycaps 114 (shown in FIG. 1). In this manner, a keyboardassembly (not shown) can be secured to top case 104 by the layer of PSAprior to securing the keyboard assembly to top case 104 with severalfasteners secured to the central cavities of top case 104.

The interior-facing surface of top case 104 also includes a materialremoval region defined by an indention region 1806. Indention region1806 is designed to allow space for moving parts of other components,such as for example display circuitry 1550 (shown in FIG. 15). Also, thetop case 104 includes an opening 1808 defined in part by side rails1802. The opening 1808 allows top case 104 to receive several internalcomponents. The opening 1808 includes a dimension 1810 which may bedefined as a length of opening 1808. It should be noted that additionaldetails regarding top case 104 can be found in U.S. ProvisionalApplication No. 62/111,042, to Reid et al., filed Feb. 2, 2015, andtitled “KEYBOARD STRUCTURE AND RETENTION FEATURES OF A PORTABLECOMPUTER”. It should be noted that speaker holes shown in top case 104have been omitted from this particular drawing for simplicity sake. Itshould also be noted that speaker holes are not required in all casesand can be routed out of top case 104 in other manners.

FIG. 19 shows a top view of an exterior cosmetic surface of top case 104and how array 1900 of speaker holes 130 can extend across a substantialportion of top case 104. Array 1900 can provide a cosmetically pleasingand uniform grid even though many of the holes are located nowhere neara speaker. Unfortunately, if each of speaker holes 130 extended entirelythrough top case 104 certain lighting conditions could cause internalcomponents to be visible through some of speaker holes 130. One way toovercome this problem is to form those speaker holes 130 not immediatelyabove internal speakers as blind holes that do not extend completelythrough top case 104. Regions 1902 indicate locations of array 1900where speaker holes 130 are positioned directly above conductive gaskets1504 of combined speaker and antenna assemblies 1500 (shown in FIG. 15).Close up view 1904 shows how speaker holes 130 can be through holes130-1 and speaker holes 130 can be blind holes 130-2. It should be notedthat in addition to creating a more uniform cosmetic appearance, blindholes 130-2 can also help top case 104 to maintain its structuralintegrity, as the blind holes do not result in as much material removalas through holes 130-1 do. Unfortunately, simply forming blind holes130-2 with no further actions would look strange as the bottom surfaceof the blind holes would still be bright aluminum, causing blind holes130-2 to be substantially different from through holes 130-1.

FIG. 20 shows a cross-sectional view of the area depicted in close upview 1904 in FIG. 19 and how the blind holes 130-2 can be made to lookmore like the through holes 130-1. A perforated portion of top case 104is depicted after having undergone a selective ink coverage process, inaccordance with some embodiments. In some embodiments, top case 104 isanodized prior to or after forming through holes 130-1 and blind holes130-2. Through holes 130-1 and blind holes 130-2 can be formed using anysuitable method, including drilling (e.g., mechanical or laserdrilling). In some embodiments, the holes are formed using computernumerical control (CNC) methods. The size and shape of each of throughholes 130-1 and blind holes 130-2 can vary depending on designrequirements and on manufacturing processes. In some embodiments, blindholes 130-2 have curved or non-planar terminal surfaces, which can be aproduct of the drilling process. For example, if a mechanical drill isused to form blind holes 130-2, terminal surfaces 2002 can be associatedwith a shape of the drill bit that is used. In some embodiments, throughholes 130-1 and blind holes 130-2 are drilled using a drilling machinewith drill bit point angle of approximately 130 degrees or 150 degrees.In other embodiments, terminal surfaces 2002 have a different shape,such as a substantially flat shape that can be formed using, forexample, a laser drilling process. In some cases, it is found thatshallower or flatter terminal surfaces 2002 result in better inkcoverage and improved darkening of blind holes 130-2.

In some embodiments, each of through holes 130-1 has substantially thesame diameter and each of blind holes 130-2 has substantially the samediameter. In some embodiments, an average diameter of through holes130-1 is substantially the same as average diameter of blind holes130-2. In other embodiments, an average diameter of through holes 130-1is substantially different than an average diameter of blind holes130-2. In a particular embodiment, an average diameter of through holes130-1 and average diameter of blind holes 130-2 are each around 0.35 mm.The average depth of blind holes 130-2 can vary depending on designrequirements as well as a desired average thickness of the wall. In someembodiments, blind holes 130-2 have substantially the same depth whilein other embodiments blind holes 130-2 have varying depths. A thicknessof top case 104 can vary depending on design. In some embodiments, blindholes 130-2 are formed about halfway through a thickness of top case104. In some embodiments, a depth of blind holes 130-2 is at least about100 micrometers. In one particular embodiment, a wall thickness of topcase 104 can be about 600 micrometers, and a depth of blind holes 130-2range between about 200 micrometers and 300 micrometers, resulting in aremaining support portion having a thickness 1908 ranging between about300 micrometers and 400 micrometers.

FIG. 20 shows substrate after ink coating 2004 is selectively depositedonto surfaces of inner walls that define blind holes 130-2, such asterminal surfaces 2002. If a printing process is used, the selectivecoating operation can be referred to as a selective printing process.Note that in some embodiments ink coating 2004 can also cover portionsof other surfaces within blind holes 130-2, such as the sidewalls. Insome embodiments, the selective depositing avoids depositing ink coating2004 onto an exterior cosmetic surface of top case 104. This can beaccomplished using an ink printer that is designed to accuratelydispense ink in predetermined two-dimensional locations. For example,ink-dispensing nozzles of an inkjet type printer can be scanned orpassed over the cosmetic surface and through holes to selectivelydeposit ink coating only within blind holes 130-2.

The method used to deposit ink coating 2004 can depend in part on thesize (i.e., diameters) of blind holes 130-2. For example, the depositiontechnique should be able to form droplets of ink that are small enoughto fit within blind holes 130-2. If blind holes 130-2 have smalldiameters, some spraying techniques may not be able to form ink dropletssmall enough to provide adequate displacement of air from blind holes130-2 during the deposition process, resulting in the ink not gettingdeposited within blind holes 130-2. Thus, the method used should be ableto provide ink droplets sufficiently small to overcome any surfacetension created when deposited within blind holes 130-2 and allowdislocation of air trapped within blind holes 130-2 during thedepositing. In some embodiments, the ink droplet size is less than about100 microliters, and in a particular embodiment, between about 10 and100 microliters. In some embodiments, this involves the use of ink jetdispenser systems where small droplets of ink are propelled through anozzle. Examples of suitable equipment include flatbed printers, suchthose manufactured by Canon Inc. (Japan), Fujifilm (Japan), and RolandDG Corporation (Japan), which can produce droplets in the scale ofpicoliters. Other equipment can include piezoelectric style jetdispensers, such as PICO® Piezoelectric jet dispensing systemsmanufactured by Nordson Corporation (headquartered in Westlake, Ohio,U.S.), which can produce droplets as small as 2 nanoliters.

In some embodiments, ink coating 2004 is a dark colored and opaque ink,such as black ink. The black ink can be made either from a pure blackink (e.g., black 265) or from a mixture of colors, such as a CMYK (cyan,magenta, yellow, and key) mixture. In some embodiments, othercombinations of inks with different colors are used. In someembodiments, the ink is mixed with a filler or binder material thatprovides more volume to ink coating 2004 to ensure full coverage ofterminal surfaces 2002. The filler or binder material can itself have acolor or can be substantially colorless. If an inkjet printer is used,the filler or binder material can be dispensed at the same time as theblack ink using a separate ink jet nozzle so that a thicker layer of inkcan be deposited per pass. In some embodiments, the filler or bindermaterial is a clear colored ink, such as clear inks used to provideglossy appearance to prints. In a particular embodiment, a black coloredink is mixed with a clear colored ink. The viscosity of the ink shouldbe sufficient to form small enough droplets of ink, as described above,but also to provide a good opaque color. Note that ink coating 2004 canhave any color and is not limited to black or dark colored ink material.For example, ink coating 2004 can have a predetermined color to match acolor of an object positioned on or near an interior surface of top case104 and visible through holes 130-1.

FIG. 20 also depicts an optionally deposited protective coating 2006that can prevent ink coating 2004 from being dislodged from blind holes130-2 or prevent ink coating 2004 from exposure to chemicals, such aschemicals used to clean top case 104, and that can lead to loss ordiscoloration of ink coating 2004 within blind holes 130-2. In someembodiments, protective coating 2006 can also reduce point reflection ofink coating 2004, thereby providing a darker color to blind holes 130-2.In some embodiments, protective coating 2006 is substantially waterresistant. Protective coating 2006 can be made of any suitable material.In some embodiments, protective coating 2006 is made of a clear ink,such as the clear ink that is mixed with a black ink for depositing inkcoating 2004 in some embodiments described above. It should be notedthat additional information regarding formation of the blind speakerholes can be found in U.S. Provisional Application No. 62/101,826, toShi et al., filed Jan. 9, 2015, and titled “TREATMENT OF A SUBSTRATESUB-SURFACE”.

FIG. 21 illustrates a bottom view of material handling feature 2102carrying keyboard assembly 2110 over the top case 104, in accordancewith the described embodiments. Material handling feature 2102 isdesigned to carry keyboard assembly 2110 in an assembly process andinstall keyboard assembly 2110 in the top case 104. Keyboard assembly2110 may include a flexible printed circuit board that includes severalkeys defining a keyboard, such as keyboard 110 (shown in FIG. 1). Theflexible circuit board is capable of bending to some degree withoutdamaging keyboard assembly 2110. In this manner, a lateral dimension ofkeyboard assembly 2110 may be larger than a lateral dimension of anopening of the top case 104, and the keyboard assembly 2110 may bend ordeform to fit into the opening of top case 104.

FIG. 22 illustrates a side view of material handling feature 2102,keyboard assembly 2110, and the top case 104 shown in FIG. 21. As shown,material handling feature 2102 actuates first arm 2104, second arm 2106,and third arm 2108 to deform keyboard assembly 2110 so that a lateraldimension of keyboard assembly 2110 is reduced to second dimension 2174,which is less than dimension 2172 of opening 2170 of top case 104.

FIG. 23 illustrates a side view of material handling feature 2102partially inserting keyboard assembly 2110 into top case 104, inaccordance with the described embodiments. As shown, material handlingfeature 2102 actuates first arm 2104 and second arm 2106 to position aportion of keyboard assembly 2110 below first side rail 2132 of top case104.

FIG. 24 illustrates a side view of material handling feature 2102 fullyinserting keyboard assembly 2110 into top case 104, in accordance withthe described embodiments. Keyboard assembly 2110 and circuit board 2120are now in an unbent configuration. As shown, material handling feature2102 actuates first arm 2104, second arm 2106, and third arm 2108 suchthat portions of keyboard assembly 2110 are under first side rail 2132and second side rail 2134. Also, material handling feature 2102 canposition keyboard assembly 210 such that some of the openings of thekeyboard assembly 2110 align with some of the end cavities of the topcase 104. For example, first end opening 2440 and second end opening2450 of the keyboard assembly 2110 are aligned with first end cavity2140 and second end cavity 2150, respectively, of top case 104. Thisallows the end openings and the end cavities to receive a fastener (notshown) to secure keyboard assembly 2110 to top case 104. It will beappreciated that the remaining end openings of keyboard assembly 2110are aligned with the remaining end cavities of top case 104 in a similarmanner.

FIGS. 25-27 show various illustrative views of another key mechanism, inaccordance with the described embodiments. In particular, FIG. 25 showsan illustrative perspective view of key mechanism 2512 in anon-depressed position. FIG. 26 shows a cross-sectional view taken alongline 26-26 in FIG. 25. And FIG. 27 shows an illustrative perspectiveview of key mechanism 2512 without a keycap assembly. As shown in FIG.25, key mechanism 2512 can include keycap 2514, laminate layer 2516,substructure 2520, switch 2540, butterfly hinge 2550, and supportstructure 2570. Key mechanism 2512 exhibits many of the same attributesof the key mechanism described and explained in U.S. Ser. No.14/499,209, to Leong et al., filed Sep. 28, 2014, and titled “LOW-TRAVELKEY MECHANISM USING BUTTERFLY HINGES”.

Butterfly hinge 2550 can form a support structure that includes wings2551, 2552. Wing 2551 can include pivot pin 2555 and keycap assembly pin2554. Wing 2552 can include pivot pin 2556 and keycap assembly pin 2557.Keycap assembly pins 1754, 1757 are coupled to substructure 2520 andpivot pins 2555, 2556 are coupled to support structure 2570. Pivot pins2555, 2556 are secured within slots 2575, 2576, respectively, of supportstructure 2570. Slots 2575, 2576 may be cavities in support structure2570 that are covered by laminate layer 2516. In effect, laminate layer2516 locks pivot pins 2555, 2556 in place within support structure 2570.In this embodiment, pivot pins 2555, 2556 and keycap assembly pins 2554,2557 all extend away from butterfly hinge 2550.

In some embodiments, switch 2540 is formed from a metal, such asstainless steel. Switch 2540 can fit in a cavity existing between wings2551, 2552, as shown. In this particular embodiment, the base of switch2540 can reside on support structure 2570, as opposed to being fixed tosubstructure 2520. When key mechanism 2512 is in its non-depressedposition, switch 2540 is in its unbuckled state and props or biases thekeycap assembly up. When key mechanism 2512 is in its depressedposition, switch 2540 will be buckled and wings 2551, 2552 will bepressed down in a log shaped position, with all keycap assembly pins2554, 2557 and pivot pins 2555, 2556 in substantially the same plane.Each wing can include upstops 2710, which are operative to limit theup-travel of the wings when the key mechanism is in its undepressedposition. Upstops 2710 may engage laminate layer 2516 in thenon-depressed position. Upstops 2710 may be shaped at an angle to enableflush interfacing with the laminate layer. In some embodiments, travelof the keycaps can be limited to between about 0.5 mm and 0.75 mm for afull keystroke.

FIG. 28 shows an illustrative side view of a portion of low-travelkeyboard assembly 2800 of a portable computing system, according to someembodiments. Specifically, FIG. 28 shows a side view of a single keyassembly of low-travel keyboard assembly 2800. The top case is omittedfrom FIG. 28 for clarity.

Key mechanism 2801, representative of remaining keycaps of low-travelkeyboard assembly 2800, may include several retaining members, such asfirst retaining member 2804 and second retaining member 2806, both ofwhich are positioned on key mechanism 2801. More specifically, as shownin FIG. 28, key mechanism 2801 may include first retaining member 2804positioned on first side 2808 of key mechanism 2801, and secondretaining member 2806 positioned on a second side 2810 of key mechanism2801, opposite first side 2808. First retaining member 2804 and secondretaining member 2806 may be formed on an underside region of keymechanism 2801 adjacent to switch housing 2820 of low-travel keyboardassembly 2800. The underside region is generally associated with aregion of key mechanism 2801 not visible to a user when key mechanism2801 is assembled with first retaining member 2804 and second retainingmember 2806. Also, as shown, switch housing 2820 includes dome switchopening 2824 that houses dome switch 2826 and LED recess 2828 adjacentto dome switch opening 2824.

The first retaining member 2804 and second retaining member 2806 may beutilized to couple key mechanism 2801 within low-travel keyboardassembly 2800, and specifically, to a hinge mechanism 2822 coupled toPCB 2830. Hinge mechanism 2822, as shown in FIG. 28, may include anysuitable hinge mechanism 2822 capable of moving key mechanism 2801 froman uncompressed state to a compressed state, including but not limitedto: a butterfly hinge mechanism, a scissor hinge mechanism, atelescoping hinge mechanism or a sliding hinge mechanism. Hingemechanism 2822 may be coupled to and/or positioned within recess 2832 ofPCB 2830. PCB 2830 may be coupled with keyboard shield 2840 via adhesive2842. In some embodiments, adhesive 2842 is a conductive adhesive.

FIG. 29 shows a front cross-sectional view of low-travel keyboardassembly 2800 taken along line CS-CS in FIG. 28. Low-travel keyboardassembly 2800 may include switch housing 2820 positioned between keymechanism 2801 and PCB 2830. In a non-limiting example, switch housing2820 may be positioned within recess 2832 of PCB 2830, and may becoupled to PCB 2830 adjacent to key mechanism 2801. Switch housing 2820may include dome switch opening 2824 formed through switch housing 2820,and LED recess 2828 formed through a portion of switch housing 2820. Asshown in FIG. 29, dome switch opening 2824 may receive and/or house domeswitch 2826, which may be compressed by key mechanism 2801 to form anelectrical connection to interact with a portable computing system.Additionally as shown in FIG. 29, LED recess 2828 of switch housing 2820may receive LED assembly 2850, which may include a light source thatemits a light through switch housing 2820 to key mechanism 2801 toprovide a light around the perimeter of key mechanism 2801 and atransparent glyph (not shown) formed through key mechanism 2801. Thetransparent glyph may be formed from a light-transparent material (e.g.,plastic) defined by a letter, number, or a symbol, any of which may befound on a keycap known in the art to allow light to pass.

As shown in FIG. 29, LED assembly 2850, and specifically contacts, orleads, of LED assembly 2850, may be in electrical contact with LEDcontact 2852 formed through PCB 2830. LED contact 2852 may be incommunication with an LED driver 2854 positioned on second surface 2862of PCB 2830. PCB 2830 may have a number of LED drivers positioned onsecond surface 2862, where each LED driver 2584 corresponds to, and isin electronic communication with LED assembly 2850 of low-travelkeyboard assembly 2800. LED driver 2854 positioned on second surface2862 of PCB 2830 may be configured to provide power and/or control toLED assembly 2850 during operation of low-travel keyboard assembly 2800included in the portable computing system 100.

As shown in FIG. 29, switch housing 2820 may include body portion 2872,and a light guide panel (LGP) portion 2874 formed integrally and moldedto body portion 2872. Body portion 2872 of switch housing 2820 mayinclude dome switch opening 2824 and LED recess 2828 formed adjacentdome switch opening 2824. Body portion 2872 may be directly coupled toPCB 2830 within recess 2832, as shown in FIG. 29. Body portion 2872 andLGP portion 2874 of switch housing 2820 may be formed from distinctmaterials. That is, body portion 2872 may be formed from a firstmaterial having substantially rigid properties for supporting keymechanism 2801 during operation of low-travel keyboard assembly 2800and/or protecting the various components (e.g., dome switch 2826, LEDassembly 2850) included within switch housing 2820. The first materialforming body portion 2872 of switch housing 2820 may also includetransparent properties for allowing light emitted by the LED assembly2850 to pass through body portion 2872 toward key mechanism 2801, asdiscussed herein. Additionally, the first material of body portion 2872may include reflective properties for reflecting the light emitted bythe LED assembly 2850 to be redirected toward key mechanism 2801.

Several features described for key mechanism 2801 of keyboard assembly2800 shown in FIGS. 28 and 29 may be incorporated into the embodimentshown in FIGS. 25-27. For instance, the key mechanism 2512 can include aswitch housing (such as switch housing 2820 and its described features),an LED assembly (such as LED assembly 2850), and/or an LGP portion (suchas LGP portion 2874).

LGP portion 2874 of switch housing 2820 may be formed integrally withbody portion 2872. More specifically, as shown in FIG. 29, LGP portion2874 may be molded to and formed integrally with body portion 2872, andmay cover dome switch opening 2824 formed in body portion 2872. LGPportion 2874 may be formed from a second material, distinct from thefirst material forming body portion 2872, and may be substantiallyflexible or deformable. As discussed herein, LGP portion 2874 maysubstantially flex and protect dome switch 2826 when key mechanism 2801is compressed. In addition to being flexible, the second materialforming LGP portion 2874 may include: substantially transparentproperties for allowing light to pass through LGP portion 2874 to keymechanism 2801, and/or substantially reflective properties to redirectlight toward key mechanism 2801.

LGP portion 2874 may be formed over dome switch opening 2824 to redirectlight toward key mechanism 2801, as discussed herein, and tosubstantially protect dome switch 2826 from undesired wear from keymechanism 2801 during operation of low-travel keyboard assembly 2800.That is, when a force is applied to key mechanism 2801 to compress keymechanism 2801, key mechanism 2801 may contact LGP portion 2874 ofswitch housing 2820, which may subsequently deform and compress domeswitch 2826 to form an electrical connection. By providing a barrierbetween key mechanism 2801 and dome switch 2826, LGP portion 2874 mayreduce the wear on dome switch 2826 over the operational life oflow-travel keyboard assembly 2800.

Switch housing 2820 may also include roof portion 2836 formed over LEDrecess 2828. More specifically, body portion 2872 of switch housing 2820may include a roof portion 2836 positioned over LED recess 2828 and LEDassembly 2850 positioned within LED recess 2828. As shown in FIG. 29,roof portion 2836 of switch housing 2820 may be formed integrally withswitch housing 2820, and specifically body portion 2872 of switchhousing 2820. However, it is understood that roof portion 2836 of switchhousing 2820 may be formed from a distinct component or material thatmay be coupled to body portion 2872 of switch housing 2820. Roof portion2836 of switch housing 2820 may be substantially opaque to prevent thelight of LED assembly 2850 from being emitted through roof portion 2836.

FIG. 30 illustrates an exploded view of several layers defining keyboardshield 3000 used with the keyboard assembly, in accordance with thedescribed embodiments. Keyboard shield 3000 may include several layersoffering several features. For example, keyboard shield 3000 may includefirst layer 3002. In some embodiments, first layer 3002 is formed from anon-electrically conductive material. For example, in some embodiments,first layer 3002 is formed from Mylar. First layer 3002 is designed toseal with a rear portion of circuit board 2120 of keyboard assembly2110. Also, first layer 3002 is designed to prevent ingress ofcontaminants from entering the portable computing system via theopenings in keyboard rib structure 1816 (shown in FIG. 18) and extendingto internal components susceptible to damage from the contaminants.Also, first layer 3002 includes several openings in locationscorresponding to the locations of the central openings of the circuitboard, with the openings of the circuit board designed to receive afastener in order to secure the circuit (and the keyboard assembly) withthe top case. In this manner, a portion of the fasteners and alignmentpins used to secure and align keyboard assembly 2110 to a top case (notshown) can extend through the openings of first layer 3002. Further, insome embodiments, first layer 3002 includes a dark color or finish, suchas matte black.

Also, in some embodiments, first layer 3002 is formed from a unitarylayer. In the embodiment shown in FIG. 30, first layer 3002 is formedfrom first section 3012 and second section 3014. Further, first section3012 and second section 3014 may be applied to circuit board 2120 by anembossing procedure. In this manner, first section 3012 and secondsection 3014 can accommodate some of the keys of the keyboard assembly2110, in particular keys in the central region, which may exert a forceto circuit board 2120 causing the central region of circuit board 2120to be non-coplanar with respect to remaining regions of circuit board2120.

Keyboard shield 3000 further includes second layer 3004. In someembodiments, second layer 3004 is formed from an electrically conductivematerial. For example, in some embodiments, second layer 3004 is formedfrom aluminum, including aluminum foil. Second layer 3004 may beelectrically connected to circuit board 2120 via conductive adhesive3010 disposed on circuit board 2120. In this manner, second layer 3004can define part of an electrical grounding path for componentselectrically connected to second layer 3004, as circuit board 2120 iselectrically connected the top case (not shown) via metal fasteners (notshown), both of which may be formed from electrically conductivematerials. Also, similar to first layer 3002, second layer 3004 includesseveral openings in locations corresponding to the locations of thecentral openings of circuit board 2120 and first layer 3002, therebyallowing a portion of the fasteners and alignment pins to extend throughthe openings of second layer 3004. Also, although not shown, secondlayer 3004 may be formed as a first section and a section in a mannersimilar to that of first layer 3002.

Keyboard shield 3000 may further include third layer 3006. In someembodiments, third layer 3006 is formed from a non-electricallyconductive material, such as Mylar. As shown, third layer 3006 includesfirst custom opening 3016 and second custom opening 3018. First customopening 3016 and second custom opening 3018 allow internal components ofa portable computing device to engage second layer 3004 such that theinternal components (not shown) are electrically grounded. Althoughshown in FIG. 30 in specific locations, first custom opening 3016 andsecond custom opening 3018 may be formed anywhere through third layer3006 in order to electrically connect an internal component to secondlayer 3004. In other embodiments, third layer 3006 includes three ormore custom openings.

With the exception of first custom opening 3016 and second customopening 3018, third layer 3006 is free of openings. Accordingly, firstlayer 3002 and second layer 3004 can combine with third layer 3006 todefine several blind holes. In this manner, a portion of the fastenersextending through first layer 3002 and second layer 3004 are generallyshielded via third layer 3006 and therefore not visible. Also, in someembodiments, third layer 3006 includes a dark color or finish, such asmatte black. Also, although not shown, third layer 3006 may be formed asa first section and a section in a manner similar to that of first layer3002.

Keyboard shield 3000 may further include tail member 3020. When keyboardshield 3000 is secured with the keyboard assembly 2110 and when thekeyboard assembly 2110 is secured with the top case (not shown) in amanner previously described, tail member 3020 is disposed in indentionregion 1806 of top case 104 (shown in FIG. 18). In some embodiments,tail member 3020 includes TEFLON. In this manner, the tail member 3020provides a relatively smooth surface for a moving part of, for example,lid portion 108 (shown in FIG. 7). As shown, tail member 3020 is securedwith third layer 3006. However, tail member 3020 may be secured withfirst layer 3002 and/or second layer 3004.

Also, although not shown, additional layers may be included withkeyboard shield 3000. For example, in some embodiments, a graphite layeris integrated with first layer 3002. The graphite layer providesimproved thermal properties. For example, the graphite layer absorbsheat generated by some internal components to spread the heat throughoutthe graphite layer. In addition, other layers including materials suchas steel, carbon fiber, and/or glass fiber can be used. These layersprovide additional protection to, for example, a battery pack that mayotherwise be susceptible to rupturing if contacted by an internalcomponent.

FIG. 31 illustrates an isometric view of an interior portion of deviceportable computing system with touch pad 112 showing the touch pad 112having force sensors and actuator 3136 for providing feedback, inaccordance with the described embodiments. The location of the user'sfinger(s) or other external object(s) in the X-Y plane of touch pad 112can be sensed using the touch sensor of touch pad 112. Downwards andupwards motion along the Z-axis can be detected using force sensors. Asshown in FIG. 31, touch pad 112 may have a touch pad member 3124(sometimes referred to as a track pad member). The touch sensor arraycan be used to measure the position of external objects such as finger3126 with respect to the X and Y lateral dimensions of touch pad member3124. As indicated by dots 3132, there may be more than one externalobject (i.e., more than one finger) touching touch pad member 3124(e.g., when a user is making a multi-touch gesture command).Arrangements in which a single object is touching touch pad member 24are sometimes described herein as an example. This is, however, merelyillustrative. One object, two objects, three objects, or more than threeobjects may simultaneously contact touch pad member 3124 if desired.

In addition to touching touch pad member 3124 at one or more locations,a user may generate button actuation events. Button actuation eventsinvolve press events in which a user presses downwards in direction 3188along the Z axis (see, e.g., coordinate system 3122). Button actuationevents also involve release events. In a release event, the user reducesthe amount of downwards force that is being applied to touch pad member3124 and stops moving finger 3126 in direction 3188 (e.g., by liftingfinger 3126 upwards in direction 3192).

Button actuation actions, which are sometimes referred to as forceapplication events, can be sensed using force sensors. As shown in FIG.31, touch pad 112 may include first force sensor 3152, second forcesensor 3154, and third force sensor 3156, all of which, as shown, engagetouch pad member 3124. In some embodiments, touch pad 112 includes fouror more force sensors. These force sensors are generally responsive toforces that are applied vertically (along the Z-axis). The force sensorsmay be placed under the four corners of a rectangular touch padstructure such as touch pad member 3124 as shown in FIG. 31 (as anexample). In configurations with two sensors, sensors can be positionedat opposing edges of touch pad member 3124. In configurations with threesensors, the sensors can be distributed so as to form a tripod-typeconfiguration. If only a single sensor is used, the sensor may belocated beneath the center of touch pad member 3124 or along an edge oftouch pad member 3124 (e.g., the leading edge).

An advantage of placing force sensors at all four corners of touch padmember 3124 is that this allows force signals from multiple sensors tobe gathered and processed in parallel. The force sensor signals may beaveraged, may be processed to help confirm the location of finger 3126on touch pad member 3124, or may be processed to determine what type ofaction should be taken by a portable computing system.

Button actuation activity or other activity (e.g., certain touch events)may result in force feedback. For example, when the user pressesdownwards on touch pad member 3124 in direction 3188, one or more offirst force sensor 3152, second force sensor 3154, and third forcesensor 3156 may compress slightly and may detect the resulting force ontouch pad member 3124. If a sufficient downwards force is detected,actuator 3136 may be used to impart movement (tactile feedback) to touchpad member 3124. With the illustrative arrangement shown in FIG. 31,actuator 3136 is coupled to touch pad member 3124 by laterally extendingarm 3140. Arm 3140 may be, for example, a strip of metal or otherstructure that is rigidly connected between the output of actuator 3136and touch pad member 3124.

When actuator 3136 is driven by a control signal, actuator 3136 drivesarm 3140 toward and/or away from touch pad member 3124 (e.g., in lateraldirections 3138 parallel to the X-axis, shown in the FIG. 31 as anexample). The movement imparted by actuator 3136 is sometimes referredto as tactile feedback, because this type of movement may be provided inresponse to a button actuation event. Users tend to expect that buttonactuation events will result in a clicking feel and sound. By drivingactuator 3136 appropriately, vibrations or other movement in touch padmember 3124 may produce a desired tactile experience for the user (e.g.,in the tips of finger 3126). For example, it may feel to the user as iftouch pad member 3124 moved downwards and engaged a conventionalmechanical switch, when in actuality, one or more of first force sensor3152, second force sensor 3154, and third force sensor 3156 allowedrelatively little vertical movement of touch pad member 3124, becausetouch pad member 3124 is mounted in a substantially fixed locationwithin a base portion of the portable computing system. If desired,actuator 3136 can impart force to arm 3140 and therefore touch padmember 3124 in response to other criteria (e.g., when certain softwareconditions arise, when the user makes certain gestures that are sensedusing the touch sensor portion of touch pad 112, etc.).

Touch pad 112 may be formed from a layered stack of structures. Forexample, touch pad member 3124 may include a printed circuit board orother substrate on which an array of touch sensor electrodes are formed.The array of electrodes may be substantially equal in size to the sizeof touch pad member 3124, so that touch pad member 3124 and the arrayextend across all of the active surface of the touch pad 112.

Stiffeners, smooth glass cover layers, and layers of ink and adhesivemay also be incorporated into touch pad member 3124. If desired, sizeand weight may be minimized by implementing touch pad 112 with fewerlayers. For example, touch pad 112 may be implemented using a glass orceramic layer with integrally formed capacitive electrodes and nostiffener, provided that touch pad 112 is still rigid. The stiffness oftouch pad member 3124 ensures that button actuation activity by a userwill be detectable by the aforementioned force sensors, regardless ofthe location at which the user presses the surface of touch pad member3124. Touch pad 112 having a touch pad member 3124 that is relativelyrigid also helps ensure that a single actuator, such as actuator 3136,or other suitable number of actuators is able to effectively generatetactile feedback over the entire surface of touch pad member 3124 (i.e.,global actuator-induced motion). If the ceramic, glass, plastic, orother layers of touch pad member 3124 that are used to form the contactsurface and touch sensor array for touch pad member 3124 are flexible, astainless steel stiffener or other suitable stiffening structure may beincorporated into touch pad member 3124. Touch pad member 3124 may alsobe stiffened by using sufficiently thick layers of glass, ceramic,plastic, or composite materials without using an extra stainless steelstiffening layer (e.g., by forming some of the layers of touch padmember 3124 from glass, ceramic, plastic, or composite material that is1 mm thick or more, 2 mm thick or more, 3 mm thick or more, or 4 mmthick or more, as examples). A rectangular shape is typically used fortouch pad member 3124, because this corresponds to the rectangular shapeof display 116 (shown in FIG. 1). Other shapes may, however, be used ifdesired. These are merely illustrative examples. Any suitable touch padstructures may be used in forming touch pad 112 if desired. Variousfeatures of touch pad 112 are described and explained in U.S. Pat. No.8,633,916, to Bernstein et al., and titled “TOUCH PAD WITH FORCE SENSORSAND ACTUATOR FEEDBACK”, the content of which is incorporated herein byreference in its entirety.

In some cases, a portable computing system may include a touch pad withadditional features. For example, FIG. 32 illustrates an enlarged topplan view of touch pad 3200 including haptic device 3202, in accordancewith the described embodiments. FIG. 33 is a cross-sectional view ofhaptic device 3202 of FIG. 32 taken along line 33-33 in FIG. 32. Hapticdevice 3202 selectively provides output or feedback to a user by moving,vibrating, or otherwise alternating feedback surface 3228 of touch pad3200. Feedback surface 3228 may be associated with a surface of a touchpad member 3124 (in FIG. 31) designed to receive an input or gesturefrom a user. Haptic device 3202 may include actuator 3224 operablyconnected to feedback surface 3228. Additionally, haptic device 3202incorporates the input sensors which may include one more force sensorssuch as first force sensor 3230A, second force sensor 3230B, third forcesensor 3230C, and fourth force sensor 3230D. Also, haptic device 3202may further include position sensors 3227 and one or more accelerationsensors (not shown). The haptic device 3202 may also include one or morebiasing supports, such as first biasing support 3234A and second biasingsupport 3234B. Although not shown, haptic device 3202 may include athird biasing support positioned below third force sensor 3230C andfourth biasing support positioned below 3230D. The biasing supportscombine to secure and support haptic device 3202 to a portable computingsystem.

Haptic device 3202, when included within the portable computing system,may be substantially surrounded by enclosure 3206, which may be similarto that of base portion 102 (shown in FIG. 1). Haptic device 3202 mayinclude feedback surface 3228 that may be supported by the one or morebiasing supports, such as first biasing support 3234A and second biasingsupport 3234B, above substrate 3236 or other support surface for theportable computing system. Also, one or more acceleration sensors (notshown) in electrical connection with, for example, feedback surface3228, actuator 3224, and position sensors 3227. The input sensors may bepositioned beneath, adjacent, or on top of feedback surface 3228. Insome embodiments, the input sensors may be integrated into feedbacksurface 3228.

Haptic device 3202 may further be operably connected to actuator 3224.Actuator 3224, which will be discussed in more detail below, selectivelymoves feedback surface 3228 to provide feedback to a user. Actuator 3224may be operably connected to feedback surface 3228 by one or moreconnection members 3238.

Actuator 3224 may receive one or more electrical signals from the aprocessor (not shown) within the portable electronic device or othercontrolling element, and those electrical signals may be converted intomechanical movement by actuator 3224. For example, in some embodiments,actuator 3224 is a solenoid actuator including a wire wound around amoveable iron core, and as a current passes through the wire coil, theiron core may move correspondingly. Specifically, the electric currentthrough the wire may create a magnetic field. The magnetic field maythen apply a force to the core or plunger, to either attract the core.In these embodiments, the actuator may also include a spring or biasingmember which may return the core to its original position after themagnetic field is removed. In other embodiments, actuator 3224 is anelectromagnet, or a series of magnets that are selectively energized toattract or repeal feedback surface 3228.

In embodiments where actuator 3224 is a solenoid or electromagnet it maybe configured to respond to one or more waveforms, which may vary themechanical output of actuator 3224. For example, the various waveformsmay vary the current through the wire, and thus may vary the magneticfield created. By changing the magnetic field different types of linearmechanical movements may be created.

It should be noted that in other embodiments, actuator 3224 is amechanism for creating mechanical movement other than a solenoidactuator. For example, actuator 3224 may be a motor, servo, series ofmagnets, or the like. As a specific example, actuator 3224 may be aseries of bar electromagnets with alternating poles that may be used tomechanically move feedback surface 3228.

In some embodiments, actuator 3224 selectively moves feedback surface3228 linearly, e.g., along the X axis and/or the Y axis illustrated inFIG. 32. In other words, feedback surface 3228 may translatehorizontally but may not move vertically with respect to enclosure 3206.In other embodiments, actuator 3224 may move feedback surface 3228vertically or a combination of vertically and linearly. However, inembodiments where actuator 3224 may move feedback surface 3228 linearly,a user in contact with feedback surface 3228 may perceive the movementof feedback surface 3228 as being vertical in nature. This is becausefeedback surface 3228 may move linearly a small distance or may movevery quickly. In some embodiments, sufficiently small lateraldisplacements can be experienced by the user as vertical movement ofsurface 3228. Such embodiments may have a thinner height than a hapticdevice employing vertical displacement.

Furthermore, because feedback surface 3228 may move linearly, the heightrequired for haptic device 3202 may be reduced, as compared with hapticdevices that require movement to produce feedback. This is because aheight of enclosure 3206 may not have to accommodate a vertical traveldistance for feedback surface 3228. Further, in these embodiments,enclosure 3206 may extend over a portion of feedback surface 3228 tobetter protect internal components of the portable computing system fromdebris or other elements. This is possible because feedback surface 3228may only need to translate beneath enclosure 3206 (and not above it) toprovide feedback to a user. In yet other embodiments, actuator 3224moves feedback surface 3228 in the vertical direction or a combinationof vertical and linear directions.

Actuator 3224 may provide a force to feedback surface 3228 (or otherportions of the haptic device 3202) to move feedback surface 3228 apredetermined distance in a direction parallel with respect to feedbacksurface 3228. The travel length in the first direction may depend on thedesired feedback. In some embodiments, actuator 3224 moves feedbacksurface 3228 in more than one direction. For example, actuator 3224 maydisplace feedback surface 3228 and then provide a second force to returnfeedback surface 3228 to its original position. However, in otherembodiments, the biasing supports, which include first biasing support134A and second biasing support 134B, may provide a biasing force thatmay return feedback surface 3228 to its original position.

It should be noted that in other embodiments, actuator 3224 can beconfigured to move feedback surface 3228 in other manners, e.g.,vertically. In yet other embodiments actuator 3224 may move feedbacksurface 3228 both in the vertical and horizontal directions.

With reference to FIGS. 32 and 33, in some embodiments, feedback surface3228 may be a relatively rectangular shape or square shape, and forcesensor 3230A, second force sensor 3230B, third force sensor 3230C, andfourth force sensor 3230D may be positioned beneath each corner oradjacent each corner of feedback surface 3228. In these embodiments, theaforementioned force sensors may determine a force input applied tosubstantially any portion of feedback surface 3228.

In other embodiments, feedback surface 3228 is shaped differently.Further, in some embodiments, there are three or fewer force sensors.For example, haptic device 3202 may include a single force sensorpositioned at a center of feedback surface 3128 and/or may includemultiple force sensors positioned around a perimeter of feedback surface3128. The location and number of the force sensors may be determinedbased on the desire sensitivity of force input desired to be captured byhaptic device 3202. Thus, if haptic device 3202 is relatively moreforce-sensitive, in those embodiments, haptic device 3202 includes fiveor more force sensors.

The force sensors may be substantially any type of sensor capable ofdetecting an exerted force. In some embodiments, the force sensors arestrain gauges. Generally, the force sensors are any other type of sensorknown in the art that are configured to detect changes in force appliedto a surface.

Position sensors 3227 (or touch sensors) may be configured to detect aninput location on feedback surface 3228. In some embodiments, positionsensors 3227 include one or more capacitive sensors. For example, hapticdevice 3202 may include a grid of electrodes operably connected tofeedback surface 3228 and configured to detect an input signal, such asa change in capacitance or other electrical change. Capacitive sensinggrids for sensing are generally known in the art, and by using ascanning technique the capacitive sensing grids can detect multipletouches on a surface substantially simultaneously. However, in otherembodiments, other position sensors are used, such as a light sensorsthat detect disruption in light signals, piezoelectric sensorspositioned on feedback surface 3228, or acoustic sensors which detectposition based on sound waves, and so on.

Acceleration sensor 3232 may detect an acceleration of a user input. Forexample, acceleration sensor 3232 may be an accelerometer that detectshow quickly a user may press on feedback surface 3228 based on anacceleration of feedback surface 3228 (to which it may be operablyconnected). Further, although actuator 3224 may move the feedbacksurface 228 vertically, the biasing supports, including first biasingsupport 134A and second biasing support 134B, may have some resiliencyso that acceleration sensor 3232 may move slightly due to an input forcein order to better detect the acceleration of the input force.

With reference to FIG. 33, first biasing support 3234A and secondbiasing support 3234B may support and operably connect the feedbacksurface 3228 to the substrate 3236 or other support surface of theportable computing system. In some embodiments, haptic device 3202 mayinclude four biasing supports, such as first biasing support 3234A andsecond biasing support 3234B, and two additional biasing supports (notshown), which each may be operably connected to a respective corner offeedback surface 3228. In these embodiments, the biasing supports may beoperably connected to feedback surface 3228 at a location substantiallyadjacent to the location of the force sensors, such as first forcesensor 3230A, second force sensor 3230B, third force sensor 3230C, andfourth force sensor 3230D.

The biasing supports previously described provide a biasing force tofeedback surface 3228 to return feedback surface 3228 to a normal orfirst position. The biasing supports may be substantially any membercapable of providing a biasing or return force to feedback surface 3228.In some embodiments, the biasing supports include a relatively flexibleand resilient member, such as a gel. In this example, the gel may be asilicon based gel, that may be positioned around the sides of feedbacksurface 3228. In other embodiments, the biasing supports may be one ormore springs spanning between substrate 3236, feedback surface 3228,and/or other types of flexible yet resilient materials. In yet otherembodiments, haptic device 3202 may use a magnetic force from one ormore magnets to return feedback surface 3228 to its original position.

Although the biasing supports described include four separate members,in some embodiments, the biasing supports may be a single integralmember. In other embodiments, haptic device 3202 includes three or lessbiasing supports.

It should be noted that the concepts and devices disclosed herein may beused or otherwise incorporated into components other than track pads ormoving elements. For example, the force sensors may be used to senseforce inputs as applied to a cover glass of a display (such as a touchsensitive display) and/or to an enclosure of a device. In theseinstances, certain elements of the disclosure, discussed in more detailbelow, may be implemented although the select device or mechanism maynot have a haptic or user output component. As a specific example, theforce sensors may be incorporated into a cover glass for a capacitivetouch display (such as for a tablet or smartphone), and may be used todetermine one or more forces correlating to one or more user inputs.However, in this example, the cover glass may not provide haptic outputto the user; for instances, the cover glass may not move or vibrate.Thus, although the term feedback surface is described with respect to ahaptic device, in some embodiments, the surface may be incorporated intonon-moving or other non-haptic devices. The haptic device 3202 isdescribed and explained in International Application PCT/US13/00086, toParivar et al., with an international filing date of Mar. 15, 2013, andtitled “VARYING OUTPUT FOR A COMPUTING DEVICE BASED ON TRACKINGWINDOWS”, the contents of each is hereby incorporated by reference intheir entirety.

FIG. 34 illustrates a plan view of interior portion 3460 of bottom case106, in accordance with the described embodiments. The “interiorportion” is generally associated with a region or surface not visible toa user when a portable electronic device is assembled. As shown, firstretention feature 3452 and second retention feature 3454 are located onfirst side region 3472 and second side region 3474, respectively, ofbottom case 106. However, it will be appreciated that first retentionfeature 3452 and/or second retention feature 3454 could be locatedanywhere along bottom case 106, such as the third side region 3476 orfourth side region 3478. Further, in some embodiments, bottom case 106includes three or more retention features.

Each retention feature is designed to receive a protrusion (discussedbelow) that is part of an interior portion of a top case (such as topcase 104 shown in FIG. 1). Each protrusion of the top case is generallylocated in positions corresponding to the location of first retentionfeature 3452 and second retention feature 3454. As such, the number ofprotrusion is equal to the number of retention features. Also, eachretention feature and protrusion can replace a fastener (for example, athreaded screw) used in traditional portable computing systems.Accordingly, this allows the top case to couple with bottom case 106without forming an opening in bottom case 106 previously used to receivethe fastener. Also, FIG. 34 shows first retention feature 3452 andsecond retention feature 3454 including first securing member 3462 andsecond securing member 3464, respectively. This will be discussed below.

In order to provide a retention force between the top case and thebottom case, each retention feature may include a securing memberdesigned to receive and retain a protrusion. The securing member mayinclude certain flexible properties designed to allow the securingmember to deform such that a protrusion, and in particular a taperedregion of the protrusion, may be secured within the securing member.However, the securing member is also designed to return to its originalshape (prior to engaging a protrusion or receiving some external force)in order to retain the protrusion.

FIG. 35 illustrates an isometric view of an embodiment of protrusion3532 engaged with securing member 3562. Protrusion 3532 and securingmember 3562 are designed to secure a top case with bottom case 106.Protrusion 3532 may include features previously described for aprotrusion associated with a top case. Also, retention feature 3552includes features similar to those of first retention feature 3452(shown in FIG. 34), and securing member 3562 may include featuressimilar to those of first securing member 3462 (shown in FIG. 34). Also,retention feature 3552 may be designed to receive tab member 3582. Tabmember 3582 is designed to provide a tension to securing member 3562such that securing member 3562 remains tensioned with (and positionedwithin) retention feature 3552. Also, tab member 3582 may includeextension 3584 that may bend or curve around securing member 3562 tofurther secure securing member 3562 with retention feature 3552.

In some embodiments, protrusion 3532 is integrally formed with aninterior region of a top case. In the embodiment shown in FIG. 35,protrusion 3532 is a separate structure mounted in an interior region ofkeyboard rib structure 1816 (shown in FIG. 18) and, in particular,mounted into a “blind hole” formed in keyboard rib structure 1816. Ablind hole refers to a partial opening in a structure, with the openingnot completely extending through the structure. Also, in someembodiments, protrusion 3532 is formed from a metal injection molding(“MIM”) process. In the embodiment shown in FIG. 35, protrusion 3532 isformed from a material removal process similar to that of a screw. Also,protrusion 3532 includes tapered region 3536, which includes firsttapered portion 3537 and second tapered portion 3538. First taperedportion 3537 and second tapered portion 3538 may include an angle withrespect to imaginary horizontal line 3592 that is parallel to bottomcase 106. The angles of first tapered portion 3537 and second taperedportion 3538 may be approximately in the range of 30 to 60 degrees withrespect to imaginary horizontal line 3592. In the embodiment shown inFIG. 35, the angles formed by first tapered portion 3537 and secondtapered portion 3538 is approximately 45 degrees with respect toimaginary horizontal line 3592. The angle of first tapered portion 3537and second tapered portion 3538 may be adjusted to increase or decreasethe retention force defined by the force created between tapered region3536 and securing member 3562. For example, by lowering the angle ofsecond tapered portion 3538, the retention force between tapered region3536 and securing member 3562 increases, and a force required toovercome the retention force to remove protrusion 3532 from securingmember 3562 must be increased. Also, bottom case 106 may cavity 3594that receives at least a portion of protrusion 3532.

In some embodiments, the retention feature 3552 is adhesively secured tobottom case 106. In other embodiments, the retention feature 3552 iswelded to the bottom case 35 n the embodiment shown in FIG. 35,retention feature 3552 is integrally formed with the bottom case 106.Accordingly, retention feature 3552 is formed from the same material asthat of the bottom case 106.

In some embodiments, securing member 3562 is formed from a metal (e.g.,steel, carbon steel). Generally, securing member 3562 may be formed fromany material having relatively high yield strength. In this manner,forces applied to securing member 3562 may cause some deformation tosecuring member 3562, yet securing member 3562 will return to itsoriginal wire form shape when the force is no longer applied to thesecuring member 3562. As shown in FIG. 35, securing member 3562 isgenerally defined by a U-shape wire form. However, securing member 3562may be defined by other wire form shapes. For example, securing member3562 may include a semi-circular region along with one or more linearregions (or linear extensions). In some embodiments, securing member3562 includes nickel plating. Further, the nickel plating may be arelatively dark color, such as black.

Also, as shown in FIG. 35, securing member 3562 is designed to extendbeyond retention feature 3552 such that securing member 3562 is capableof retaining protrusion 3532, and in particular, tapered region 3536.The portion of securing member 3562 extending beyond retention feature3552 may be defined by first extension 3566 and second extension 3568.As shown, first extension 3566 and second extension 3568 engage taperedregion 3536.

In some embodiments, tab member 3582 is formed form a metal (e.g.,steel, stainless steel, aluminum). Also, tab member 3582 may beindependently formed with respect to retention feature 3552. However, inother embodiments, tab member 3582 integrally formed with retentionfeature 3552 such that only an extension (e.g., extension 3584) definestab member used to secure securing member 3562. Further, tab member 3582may include a thickness approximately in the range of 0.1 to 0.3millimeters. Also, in order to maintain tab member 3582 within retentionfeature 3552, tab member 3582 include first hook feature 3586 and secondhook feature 3588, as shown in FIG. 35.

It will be appreciated that the various features shown and described inFIG. 35 may be applied to other features associated with the top caseand/or the bottom case. For example, second retention feature 3454 andsecond securing member 3464 (both shown in FIG. 34) may include anyfeature previously described for retention feature 3552 and securingmember 3562, respectively.

FIG. 36 illustrates a plan view of interior portion 3660 of bottom case3606 having securing members disposed on an outer peripheral portion ofbottom case 3606, in accordance with the described embodiments. Forexample, first side 3672 includes first retention feature 3652 havingfirst securing member 3662. Also, second side 3674 includes secondretention feature 3654 having second securing member 3664. Further,third side 3676 and fourth side 3678 include several retentionsfeatures, each of which includes a securing member. For example, thirdside 3676 includes third retention feature 3656 having third securingmember 3666, and fourth side 3678 includes fourth retention feature 3658having fourth securing member 3668. In this configuration, bottom case3610 may include a sufficient number of retention features and securingmembers such that a top case of a portable computing system thatincludes an equal number of protrusions as the number of retentionfeatures can be secured with the securing members of bottom case 3606.This would allow for bottom case 3606 that does not require anyfasteners (and as such, any openings to receive the fasteners) to besecured with a top case.

FIG. 37 illustrates a plan view of an alternate embodiment of retentionfeature 3752 having grooved region 3754 defined by an additionalmaterial removal region, in accordance with the described embodiments.Grooved region 3754 allow for additional movement and/or rotationalpositioning of structural features positioned within grooved region3754. For example, securing member 3762 is able to pivot or rotate aboutretention feature 3752. This allows for some flexibility or additionaltolerance for placement of a protrusion (not shown) of a top case. Inother words, securing member 3762, having additional rotational movementdue in part to grooved region 3754 of retention feature 3752, can rotateor pivot in a direction toward the protrusion to mechanically interlockwith the protrusion.

FIG. 38 illustrates an isometric view of an embodiment of retentionfeature 3852 including tab member 3882 integrally formed with retentionfeature 3852. Rather than include a separate tab member (e.g., tabmember 3552 shown in FIG. 35), tab member 3882 used to secure securingmember 3862 within retention feature 3852 is already located onretention feature 3852. Once securing member 3862 is positioned withinretention feature 3852, tab member 3882 may be deformed or bent toretain securing member 3862. This allows for fewer parts in a portablecomputing system. Also, retention feature 3852 may be secured to abottom case of a portable computing system (not shown) by means such asadhesive securing, soldering, or welding. Alternatively, retentionfeature 3852 may be integrally formed with the bottom case.

FIG. 39 shows a cross-sectional view of one end of top case 104 andbottom case 106 (shown in FIG. 1) that includes metallic structures 3902and 3904 that shield magnetic field sensor 3906 from magnetic fieldsoriginating from a bottom surface of top case 104. Magnetic field sensor3906 may be designed to detect a magnetic field emitted by a magnet in alid portion of a portable computing system 100 (shown in FIG. 1). Asshown, metallic structure 3904 is generally below metallic structure3902 in a dimension (for example, a vertical z-dimension). In thismanner, metallic structures 3902 and 3904 combine to define a magneticshield such that magnetic field 3908 generated by external magnet 3952of device 3950 is diverted in a direction away from magnetic fieldsensor 3906, as depicted. Generally, metallic structures 3902 and 3904are designed to divert or redirect any magnetic field other than themagnetic field generated by a magnet disposed within lid portion 108. Inthis manner, magnetic field sensor 3906 does not generate the electricalsignal (used to place portable computing system 100 in a “sleep mode”)in response to external magnet 3952 in close proximity to the portablecomputing system 100. Also, an air gap 3910 defined as a void or spacebetween metallic structure 3902 and metallic structure 3904 can furtherimpede magnetic field 3908 from reaching magnetic field sensor 3906.

The enlarged view shows third layer 3006 (of keyboard shield 3000, shownin FIG. 30) partially removed such that metallic structure 3902 iselectrically connected to second layer 3004 via a first conductiveadhesive layer 3912. Metallic structure 3902 is then electricallygrounded. Also, metallic structure 3904 can be adhesively secured withbottom case 106 by second conductive adhesive 3914 such that metallicstructure 3904 is also electrically grounded. Metallic structures 3902and 3904 offer a lightweight and low-cost solution. Further, magneticfield sensor 3906 can be a relatively simplistic sensor and need notinclude complex features. For example, a second sensor used as a“confirmation” sensor to detect a second magnet (not shown) in lidportion 108 is not required, due to the increased reliability ofmagnetic field sensor 3906. It should be noted that additional detailsregarding the magnetic shielding can be found in U.S. ProvisionalApplication No. 62/111,042, to Reid et al., filed Feb. 2, 2015, andtitled “KEYBOARD STRUCTURE AND RETENTION FEATURES OF A PORTABLECOMPUTER”.

FIG. 40A shows a close up view of a left side of portable computingsystem 100 and data port 126. In some embodiments, data port 126 canserve as the only physical connector port for transferring high-speeddata or receiving external power. In one particular embodiment, dataport 126 can take the form of a USB—C type port. Data port 126 can be anomnidirectional port configured to receive a connector plug in a numberof different orientations. In some embodiments, a sidewall of baseportion 102 can remove the need for a connector shell by forming all ofa receptacle for receiving a plug, thereby replacing a sheet metal shellthat generally supports a connector of this type. In this way, only edgeconnector 4002 of a printed circuit board (PCB) secured to top case 104needs to be provided on the PCB that supports data port 126 with thecontacts needed to provide the electrical coupling between the connectorplug and internal components of portable computing system 100. In oneparticular embodiment, edge connector 4002 can be a thin protrudingportion, sometimes referred to as a tongue of the PCB with certaincontacts configured to transfer and receive data and other contactsconfigured to receive external power. In some embodiments, the PCB canbe flexibly mounted to data port 126 so edge connector 4002 of the PCBcan shift in the event of a drop event that occurs when the connectorplug is engaged in data port 126. In some embodiments, the opening canbe a blind hole with an opening in the rear passing entirely through thewall that is only big enough for edge connector 4002 of the PCB. In thisway, the smaller through hole can define a location of edge connector4002 within data port 126. In some embodiments, an end of the blind holethat surrounds the opening passing through the wall of base portion 102can include a rubber gasket or other protective layer configured toprevent scratching or wear upon the receptacle from repeated insertionand extractions of a connector plug. It should be noted that in someembodiments sidewalls defining the receptacle of for data port 126 canbe conductive in nature so that a plug engaging data port 126 can begrounded to base portion 102. In some embodiments, making these wallsconductive can involve selectively removing a protective layer such asan anodization layer from the metal defining the receptacle. FIG. 40Bshows a perspective view of an exemplary electric plug 4004 configuredto engage data port 126.

FIGS. 40C-40D show cross-sectional views of data port 126 in accordancewith section line F-F, as depicted in FIG. 40A. FIG. 40C shows how thesidewall defines a receptacle portion of data port 126. In thesedepictions, top case 104 defines the sidewall of base portion 102 thatdefines the receptacle portion of data port 126. FIG. 40C also shows howthe blind hole portion extends through a majority of the sidewall andthen a smaller aperture extends completely through a remaining thicknessof the sidewall. It should be noted that based upon a desired size ofthe receptacle and an amount of play desired for edge connector 4002 athickness through which the smaller aperture extends may be greater orsmaller. In this way, the length of the smaller rectangular aperture canbe adjusted to allow edge connector 4002 to pivot within the portion ofthe receptacle defined by the sidewall. In this way, edge connector 4002can make accommodations for drop events, which can reduce a risk of edgeconnector 4002 snapping off during a drop event. FIG. 40D shows anothercross-sectional view in which plug 4004 is engaged within data port 126.Because plug 4004 is a symmetric plug and data port 126 a symmetricport, plug 4004 can be inserted in at least two different orientations.Patent application Ser. No. 14/543,748, filed Nov. 17, 2014 and entitled“Connector Receptacle Having a Tongue” by Amini et. al, describesvarious embodiments of this unitary data and power port in greaterdetail and is hereby incorporated by reference.

FIGS. 41A-41B show partial cross-sectional views of alternative dataport embodiments. FIG. 41A shows an embodiment that includes two groundplates 4102 held in place by collar 4104. In some embodiments, groundplates 4102 can extend through different openings than the openingthrough which edge connector 4002 extends. FIG. 41B shows an embodimentin which a grounding jacket 4106 surrounds edge connector and groundsedge connector 4002 with top case 104. In some embodiments, one or moreelectrical contacts positioned on edge connector 4002 can be grounded totop case through grounding jacket 4106.

FIGS. 42-43 show different views of flexible connector 4200, which isresponsible for routing power and high-speed data between data port 126and another electrical components disposed within base portion 102(shown in FIG. 40A). High-speed data can be transmitted and receivedusing many different types of protocols. In some embodiments, data port126 can be configured to simultaneously transmit and receive one or moreprotocols including one or more of the following protocol types: USB3.0, USB 2.0, DisplayPort®, Thunderbolt®, DVI, HDMI, etc. Furthermore,flexible connector 4200 can include flexible substrate 4202 which isformed of a number of layers for transmitting the high-speed data. Insome embodiments, the layers can include a discrete layer fortransmitting power. In some embodiments, the layers can also include agrounding layer.

FIG. 42 shows how flexible connector 4200 can also include electricalcomponent 4204 surface mounted to flexible substrate 4202. Electricalcomponent 4204 includes a shielding can that prevents electromagneticradiation emitted from the electrical component from affecting othercomponents. Furthermore, electrical component 4204 includes a layer ofconductive foam atop the shielding that can allow the shielding can tobe grounded to an electrically conductive internal surface of baseportion 102 for electrical grounding purposes. Electrical component 4204can be configured to boost signals routed through flexible substrate4202. In this way, flexible connector 4200 can be longer than wouldotherwise be possible in applications where high signal strength wasrequired. Furthermore, in addition to the boosting components ofelectrical component 4204, electrical component 4204 can also includemultiplexing circuitry for combining and separating the various signalsreceived through data port 126. For example, in some embodiments, bothDisplayPort® and USB 3.0 inputs can be received through electricalconnector. The multiplexing circuitry can be used to separate andcombine these signals as needed for use of the data by portablecomputing system 100. Flexible connector 4200 also includes twoboard-to-board connectors disposed at opposite ends of flexiblesubstrate 4202. First end 4206 can include multiple bends that allowflexible substrate 4202 to more easily bend and flex to accommodatevarious operations during an assembly process. FIG. 43, which shows theopposite side of flexible connector 4200, depicts how the multiple bendslook when flexible substrate 4202 is flattened out. FIG. 43 also showsan appearance of the board-to-board connector positioned at second end4208. Also visible in FIG. 43 are stiffeners 4210 and 4212 which supportthe shielding and the board-to-board connector at first end 4206respectively.

FIG. 44 shows how flexible connector 4200 can be utilized toelectrically couple two electrical components within portable computingsystem 100: main logic board 4410 and I/O board 4412. As depicted, bendregions of flexible connector 4200 allows for translation of bottom case106 with respect to top case 104 along axis 4414 and for rotation ofbottom case 106 with respect to top case 104 about axis of rotation4416. Further details regarding flexible connector 4200 are disclosed inU.S. Provisional Application No. 62/106,667, to Sweet et al., filed Jan.22, 2015, and titled “HYBRID ACOUSTIC EMI FOAM FOR USE IN A PERSONALCOMPUTER”.

FIG. 45 illustrates flowchart 4500 showing a method for forming aportable computing system, in accordance with the described embodiments.In step 4502, a keyboard assembly is engaged with a material-handlingfeature that includes a first arm and a second arm. The first arm andthe second arm may include a first attachment feature and a secondattachment feature, respectively. In some embodiments, the firstattachment feature and the second attachment feature are suction cups.Also, the keyboard assembly can include a first end, a second endopposite the first end, and a first dimension defined by the first endand the second end. The first dimension also defines a length of thekeyboard assembly.

In step 4504, the keyboard assembly is deformed or bent, using thematerial-handling feature, to reduce the keyboard assembly to a seconddimension less than the first dimension. Although the keyboard assemblyis bent, the keyboard assembly and a circuit board of the keyboardassembly are designed to withstand damage due to the aforementionedbending event.

In step 4506, the keyboard assembly is inserted into a top case having afirst side rail, a second side rail, and an opening having a thirddimension defined by the first side rail and the second side rail. Thethird dimension can be defined as a length of the opening. Also, thethird dimension is less than the first dimension but greater than thesecond dimension. The bent configuration of the keyboard assembly allowsthe keyboard assembly to be inserted into the top case.

In step 4508, the keyboard assembly is straightened to the firstdimension. This may be performed by actuating the first arm and thesecond arm (and in some cases a third arm) of the material-handlingfeature.

In step 4510, the keyboard assembly is secured to the top case. This caninclude the use of an assembly mechanism having several fastenerreceivers secured to a main body of the assembly mechanism. Also,fastener receivers may be angled. Further, the circuit board of thekeyboard assembly may include angled openings at the first end andsecond end of the keyboard assembly. Also, the top case may includeangled cavities proximate to the first side rail and the second siderail. In this manner, each fastener receiver can receive a fastener thatcan be inserted, at an angle, into an angled opening of the keyboardassembly and angled cavity of the top case. Also, the fastener and theangled cavity may be threaded such that the fastener is in threadedengagement with the angled cavity.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of specific embodimentsare presented for purposes of illustration and description. They are notintended to be exhaustive or to limit the described embodiments to theprecise forms disclosed. It will be apparent to one of ordinary skill inthe art that many modifications and variations are possible in view ofthe above teachings.

What is claimed is:
 1. An electrical assembly, comprising: an assemblyhousing defining an interior volume and comprising an audio port; aconductive gasket comprising a sheet of conductive fabric wrapped arounda closed cell foam substrate; and an antenna component disposed along anexterior surface of the assembly housing, wherein the conductive gasketprevents electromagnetic interference (EMI) emitted by the antennacomponent from entering the assembly housing through the audio port whenthe antenna component is active.
 2. The electrical assembly as recitedin claim 1, wherein the conductive gasket is coupled with an exteriorsurface of the assembly housing and surrounds the audio port.
 3. Theelectrical assembly as recited in claim 1, further comprising an audiotransducer disposed within the interior volume and oriented towards theaudio port.
 4. The electrical assembly as recited in claim 1, whereinthe assembly housing is formed of non-conductive material and whereinportions of the assembly housing are covered with conductive materialthat shields portions of the assembly housing from the EMI emitted bythe antenna component.
 5. The electrical assembly as recited in claim 4,wherein the conductive gasket inhibits an electric field emitted by theaudio transducer in operation from interfering with the antennacomponent.
 6. The electrical assembly as recited in claim 1, furthercomprising a flexible circuit extending from the audio transducer andthrough the assembly housing.
 7. The electrical assembly as recited inclaim 6, wherein the flexible circuit is configured to transmit audiosignals to the audio transducer.
 8. The electrical assembly as recitedin claim 1, wherein the audio port is covered by an acoustic membrane ofthe audio transducer and wherein the acoustic membrane isnon-conductive.
 9. A portable computing device, comprising: a devicehousing defining a plurality of speaker openings; and a speaker assemblydisposed within the device housing, the speaker assembly comprising: anassembly housing defining an acoustic volume, the assembly housingcomprising an audio port, a gasket coupled with an exterior surface ofthe assembly housing and surrounding the audio port, the gasketcomprising a closed cell foam substrate defining a plurality ofperforations plated with conductive material, an antenna componentcoupled with the exterior surface of the assembly housing, and a speakercomponent disposed within the assembly housing, wherein the gasket ofthe speaker assembly engages an interior surface of the device housingand surrounds the plurality of speaker openings to conduct audio wavesfrom the speaker component and through the plurality of speakeropenings.
 10. The portable computing device as recited in claim 9,further comprising a sheet of conductive fabric wrapped around thegasket.
 11. The portable computing device as recited in claim 9, whereinthe plurality of perforations are plated with a nickel alloy.
 12. Anassembly method, comprising: receiving a closed cell foam substratedefining a plurality of perforations plated with conductive material;wrapping the closed cell foam substrate in conductive fabric to form aconductive gasket; and securing the conductive gasket around a speakerport of an audio assembly.
 13. An electrical assembly, comprising: anassembly housing defining an interior volume and comprising an audioport; a conductive gasket comprising a sheet of conductive fabricwrapped around a closed cell foam substrate; and an antenna componentdisposed along an exterior surface of the assembly housing, wherein theconductive gasket prevents electromagnetic interference (EMI) emitted bythe antenna component from entering the assembly housing through theaudio port when the antenna component is active.
 14. The electricalassembly as recited in claim 13, wherein the conductive gasket iscoupled with an exterior surface of the assembly housing and surroundsthe audio port.
 15. The electrical assembly as recited in claim 13,further comprising an audio transducer disposed within the interiorvolume and oriented towards the audio port.
 16. The electrical assemblyas recited in claim 15, wherein the assembly housing is formed ofnon-conductive material and wherein portions of the assembly housing arecovered with conductive material that shields portions of the assemblyhousing from the EMI emitted by the antenna component.
 17. Theelectrical assembly as recited in claim 16, wherein the conductivegasket inhibits an electric field emitted by the audio transducer inoperation from interfering with the antenna component.
 18. Theelectrical assembly as recited in claim 13, further comprising aflexible circuit extending from an audio transducer disposed within theassembly housing and through the assembly housing.
 19. The electricalassembly as recited in claim 18, wherein the flexible circuit isconfigured to transmit audio signals to the audio transducer.
 20. Theelectrical assembly as recited in claim 18, wherein the audio port iscovered by an acoustic membrane of the audio transducer and wherein theacoustic membrane is non-conductive.